Intel BX80616I3540, Design Manual

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Thermal and Mechanical Design Guide 3
Contents
1 Introduction ..............................................................................................................7
1.1 References .........................................................................................................8
1.2 Definition of Terms ..............................................................................................8
2 LGA1366 Socket ...................................................................................................... 11
2.1 Board Layout .................................................................................................... 13
2.2 Attachment to Motherboard ................................................................................ 14
2.3 Socket Components........................................................................................... 14
2.3.1
Socket Body Housing .............................................................................. 14
2.3.2 Solder Balls ........................................................................................... 14
2.3.3 Contacts ............................................................................................... 15
2.3.4 Pick and Place Cover............................................................................... 15
2.4 Package Installation / Removal ........................................................................... 16
2.4.1
Socket Standoffs and Package Seating Plane.............................................. 16
2.5 Durability ......................................................................................................... 17
2.6 Markings .......................................................................................................... 17
2.7 Component Insertion Forces ............................................................................... 17
2.8 Socket Size ...................................................................................................... 17
2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 18
3 Independent Loading Mechanism (ILM) ................................................................... 19
3.1 Design Concept................................................................................................. 19
3.1.1
ILM Cover Assembly Design Overview ....................................................... 19
3.1.2 ILM Back Plate Design Overview............................................................... 20
3.2 Assembly of ILM to a Motherboard....................................................................... 20
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 23
4.1 Component Mass............................................................................................... 23
4.2 Package/Socket Stackup Height .......................................................................... 23
4.3 Socket Maximum Temperature............................................................................ 23
4.4 Loading Specifications........................................................................................ 24
4.5 Electrical Requirements...................................................................................... 24
4.6 Environmental Requirements .............................................................................. 25
5 Sensor Based Thermal Specification Design Guidance .............................................. 27
5.1 Sensor Based Specification Overview ................................................................... 27
5.2 Sensor Based Thermal Specification..................................................................... 28
5.2.1
TTV Thermal Profile ................................................................................ 28
5.2.2 Specification When DTS value is Greater than TCONTROL ............................ 29
5.3 Thermal Solution Design Process ......................................................................... 30
5.3.1
Boundary Condition Definition .................................................................. 30
5.3.2 Thermal Design and Modelling.................................................................. 31
5.3.3 Thermal Solution Validation ..................................................................... 32
5.4 Fan Speed Control (FSC) Design Process .............................................................. 33
5.4.1
Fan Speed Control Algorithm without TAMBIENT Data ................................. 34
5.4.2 Fan Speed Control Algorithm with TAMBIENT Data...................................... 35
5.5 System Validation ............................................................................................. 36
5.6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL ........... 37
6 ATX Reference Thermal Solution .............................................................................. 39
6.1 Operating Environment ...................................................................................... 39
6.2 Heatsink Thermal Solution Assembly.................................................................... 40
6.3 Geometric Envelope for the Intel
®
Reference ATX Thermal Mechanical Design ........... 41
6.4 Reference Design Components ............................................................................ 42