Sensor Based Thermal Specification Design Guidance
28
Thermal/Mechanical Design Guide
5.2
Sensor Based Thermal Specification
The sensor based thermal specification consists of two parts. The first is a thermal
profile that defines the maximum TTV T
CASE
as a function of TTV power dissipation. The
thermal profile defines the boundary conditions for validation of the thermal solution.
The second part is a defined thermal solution performance (
Ψ
CA
) as a function of the
DTS value as reported over the PECI bus when DTS is greater than T
CONTROL
. This
defines the operational limits for the processor using the TTV validated thermal
solution.
5.2.1
TTV Thermal Profile
For the sensor based specification the only reference made to a case temperature
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
Note:
All functional compliance testing will be based on fan speed response to the reported
DTS values above T
CONTROL
. As a result no conversion of TTV T
CASE
to processor T
CASE
will be necessary.
Figure 5-1. Comparison of Case Temperature vs. Sensor Based Specification
Power
Sensor Based Specification (DTS Temp)
TDP
Tcontrol
Ta = 30 C
Ψ
-ca = 0.362
Ψ
-ca = 0.292
Power
Current Specification (Case Temp)
TDP
Tcontrol
Ta = 43.2 C
Ta = 30 C
Ψ
-ca = 0.292
Power
Sensor Based Specification (DTS Temp)
TDP
Tcontrol
Ta = 30 C
Ψ
-ca = 0.362
Ψ
-ca = 0.292
Power
Current Specification (Case Temp)
TDP
Tcontrol
Ta = 43.2 C
Ta = 30 C
Ψ
-ca = 0.292
Summary of Contents for BX80616I3540
Page 10: ...Introduction 10 Thermal Mechanical Design Guide...
Page 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Page 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Page 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...