Thermal and Mechanical Design Guide
5
B-6 Reference Design Heatsink Assembly (2 of 2) ............................................................. 57
B-7 Reference Fastener Sheet 1 of 4 ............................................................................... 58
B-8 Reference Fastener Sheet 2 of 4 ............................................................................... 59
B-9 Reference Fastener Sheet 3 of 4 ............................................................................... 60
B-10 Reference Fastener Sheet 4 of 4 ............................................................................... 61
B-11 Reference Clip - Sheet 1 of 2.................................................................................... 62
B-12 Reference Clip - Sheet 2 of 2.................................................................................... 63
C-1 Socket Mechanical Drawing (Sheet 1 of 4).................................................................. 66
C-2 Socket Mechanical Drawing (Sheet 2 of 4).................................................................. 67
C-3 Socket Mechanical Drawing (Sheet 3 of 4).................................................................. 68
C-4 Socket Mechanical Drawing (Sheet 4 of 4).................................................................. 69
D-1 Processor Installation Tool ....................................................................................... 72
Tables
1-1 Reference Documents.................................................................................................8
1-2 Terms and Descriptions ..............................................................................................8
4-1 Socket Component Mass ........................................................................................... 23
4-2 1366-land Package and LGA1366 Socket Stackup Height............................................... 23
4-3 Socket and ILM Mechanical Specifications.................................................................... 24
4-4 Electrical Requirements for LGA1366 Socket ................................................................ 25
5-1 Thermal Solution Performance above TCONTROL.......................................................... 37
6-1 Processor Thermal Solution Requirements & Boundary Conditions................................... 39
7-1 Use Conditions (Board Level)..................................................................................... 47
A-1 Reference Heatsink Enabled Components .................................................................... 49
A-2 LGA1366 Socket and ILM Components ........................................................................ 49
A-3 Supplier Contact Information ..................................................................................... 49
B-1 Mechanical Drawing List............................................................................................ 51
C-1 Mechanical Drawing List............................................................................................ 65
Summary of Contents for BX80616I3540
Page 10: ...Introduction 10 Thermal Mechanical Design Guide...
Page 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Page 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Page 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...