Intel BX80616I3540, Design Manual, Page: 7 / 72

Thermal/Mechanical Design Guide 7
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for the:
• Intel® Xeon® Processor 3500 Series
Unless specifically required for clarity, this document will use “processor” in place of the
specific product names. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the appropriate
processor Datasheet.
Figure 1-1. Processor Thermal Solution & LGA1366 Socket Stack