Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
93
Figure 7-22. Third Tape Installation
12.
Place a 3
rd
piece of tape at the end of the step in the groove as shown in
Figure 7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13.
Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section D.5.1.step 3 (Figure 7-23).
Figure 7-23. Measuring Resistance between Thermocouple and IHS
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
