ATX Thermal/Mechanical Design Information
60
Thermal and Mechanical Design Guidelines
6.7
Reference Attach Mechanism
6.7.1
Structural Design Strategy
Structural design strategy for the reference design is to minimize upward board
deflection during shock to help protect the LGA775 socket.
The reference design uses a high clip stiffness that resists local board curvature under
the heatsink, and minimizes, in particular, upward board deflection (Figure 6-5). In
addition, a moderate preload provides initial downward deflection.
Figure 6-5. Upward Board Deflection during Shock
The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target
for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The
nominal preload provided by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb].
Note:
Intel reserves the right to make changes and modifications to the design as necessary
to the reference design, in particular the clip and fastener.
Less curvature in
region under stiff clip
Shock Load
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
