Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
47
5.4
Safety Requirements
Heatsink and attachment assemblies shall be consistent with the manufacture of units
that meet the safety standards:
•
UL Recognition-approved for flammability at the system level. All mechanical and
thermal enabling components must be a minimum UL94V-2 approved.
•
CSA Certification. All mechanical and thermal enabling components must have
CSA certification.
•
All components (in particular the heatsink fins) must meet the test requirements
of UL1439 for sharp edges.
•
If the International Accessibility Probe specified in IEC 950 can access the moving
parts of the fan, consider adding safety feature so that there is no risk of personal
injury.
5.5
Geometric Envelope for Intel
®
Reference BTX
Thermal Module Assembly
Figure 7-43 through Figure 7-47 in Appendix G provides the motherboard keep-out
information for the BTX thermal mechanical solutions. Additional information on BTX
design considerations can be found in the Balanced Technology Extended (BTX)
System Design Guide available atThe maximum height of the TMA above the motherboard is 60.60 mm [2.386 inches],
for compliance with the motherboard primary side height constraints defined in the
BTX Interface Specification for Zone A, found at
http://www.formfactors.org
.
Figure 5-4. Intel
®
Type II TMA 65W Reference Design
Development vendor information for the Intel Type II TMA Reference Solution is
provided in Appendix H.
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
