Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
97
24.
You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure 7-28 and Figure 7-29).
Figure 7-28. View Through Lens at Solder Station
Figure 7-29. Moving Solder back onto Thermocouple Bead
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
