Case Temperature Reference Metrology
100
Thermal and Mechanical Design Guidelines
31.
Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (Figure 7-33).
Figure 7-33. Filling Groove with Adhesive
32.
To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (Figure 7-34).
Figure 7-34. Application of Accelerant
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
