ATX Thermal/Mechanical Design Information
52
Thermal and Mechanical Design Guidelines
Figure 6-1. E18764-001 Reference Design – Exploded View
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
The ATX motherboard keep-out and the height recommendations defined Section 6.6
remain the same for a thermal solution for the processor in the 775-Land LGA
package.
Note:
If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection (such as,
protection barriers, a cage, or an interlock) against contact with the energized fan by
the user during user servicing.
Note:
Development vendor information for the reference design is provided in Appendix H.
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
