LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines
71
Figure 7-6. Board Deflection Definition
d1
d2
d’1
d’2
A.3.2
Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm
And
d’_BOL – d’_ref≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
