Intel 440GX, Design Manual

Page: 5 / 118

Intel
®
440GX AGPset Design Guide v
3.7 82371EB (PIIX4E).......................................................................................3-16
3.7.1
PIIX4E Connections.......................................................................3-16
3.7.2 IDE Routing Guidelines..................................................................3-20
3.7.2.1
Cabling..........................................................................3-20
3.7.2.2 Motherboard .................................................................3-20
3.7.3 PIIX4E Power And Ground Pins ....................................................3-22
3.8 PCI Bus Signals ..........................................................................................3-22
3.9 ISA Signals .................................................................................................3-23
3.10 ISA and X-Bus Signals................................................................................3-23
3.11 USB Interface..............................................................................................3-24
3.12 IDE Interface ...............................................................................................3-24
3.13 Flash Design ...............................................................................................3-25
3.13.1 Dual-Footprint Flash Design ..........................................................3-25
3.13.2 Flash Design Considerations .........................................................3-25
3.14 System and Test Signals ............................................................................3-28
3.15 Power Management Signals .......................................................................3-28
3.15.1 Power Button Implementation ........................................................3-30
3.16 Miscellaneous .............................................................................................3-31
3.17 82093AA (IOAPIC)......................................................................................3-32
3.18 Manageability Devices ................................................................................3-33
3.18.1 Max1617 Temperature Sensor ......................................................3-33
3.18.2 LM79 Microprocessor System Hardware Monitor ..........................3-33
3.18.3 82558B LOM Checklist ..................................................................3-34
3.18.4 Wake On LAN (WOL) Header........................................................3-35
3.19 Software/BIOS ............................................................................................3-35
3.19.1 USB and Multi-processor BIOS .....................................................3-35
3.19.2 Design Considerations...................................................................3-36
3.20 Thermals / Cooling Solutions ......................................................................3-36
3.20.1 Design Considerations...................................................................3-36
3.21 Mechanicals ................................................................................................3-36
3.21.1 Design Considerations...................................................................3-37
3.22 Electricals....................................................................................................3-37
3.22.1 Design Considerations...................................................................3-37
3.23 Layout Checklist..........................................................................................3-38
3.23.1 Routing and Board Fabrication ......................................................3-38
3.23.2 Design Consideration.....................................................................3-38
3.24 Applications and Add-in Hardware..............................................................3-38
3.24.1 Design Consideration.....................................................................3-38
4 Debug Recommendations .........................................................................................4-1
4.1 Slot 1 Test Tools ...........................................................................................4-1
4.2 Debug/Simulation Tools................................................................................4-1
4.2.1
Logic Analyzer Interface (LAI)..........................................................4-1
4.2.2 In-Target Probe (ITP).......................................................................4-1
4.2.3 Bus Functional Model (BFM) ...........................................................4-2
4.2.4 I/O Buffer Models .............................................................................4-2
4.2.5 FLOTHERM* Model .........................................................................4-2