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8

603 Hardware Specifications, REV 2

Preliminary—Subject to Change without Notice 

Table 6. Input AC Timing Specifications 

Vdd = 3.3 

±

 5% V dc, GND = 0 V dc

 T

J

 

 105 

°

C

Num

Characteristic

25 MHz

33.33 MHz

40 MHz

50 MHz

66.67 MHz

Unit

Notes

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

10a

Address/data/transfer
attribute inputs valid 
to SYSCLK (input 
setup)

4.5

4.0

3.5

3.0

2.5

ns

2

10b

All other inputs valid 
to SYSCLK (input 
setup)

6.5

6.0

5.5

5.0

4.5

ns

3

10c

Mode select inputs 
valid to HRESET 
(input setup)
(for DRTRY, QACK 
and TLBISYNC)

8 * 

t

sys

8 * 

t

sys

8 * 

t

sys

8 * 

t

sys

8 * 

t

sys

ns

4,5,

6,7

11a

SYSCLK to 
address/data/transfer
attribute inputs 
invalid (input hold)

1.0

1.0

1.0

1.0

1.0

ns

2

11b

SYSCLK to all other 
inputs invalid (input 
hold)

1.0

1.0

1.0

1.0

1.0

ns

3

11c

HRESET to mode 
select inputs invalid 
(input hold)
(for DRTRY, QACK, 
and TLBISYNC)

0

0

0

0

0

ns

4,6,7

Notes: 1. All input specifications are measured from the TTL level (0.8 or 2.0 V) of the signal in question to the 1.4 V of the 

rising edge of the input SYSCLK. Both input and output timings are measured at the pin. See Figure 2.

2. Address/data/transfer attribute input signals are composed of the following: A0–A31, AP0–AP3, TT0–TT4, 

TC0–TC1, TBST, TSIZ0–TSIZ2, GBL, DH0–DH31, DL0–DL31, DP0–DP7.

3. All other input signals are composed of the following: TS, XATS, ABB, DBB, ARTRY, BG, AACK, DBG, DBWO, TA, 

DRTRY, TEA, DBDIS,HRESET, SRESET, INT, SMI, MCP, TBEN, QACK, TLBISYNC.

4. The setup and hold time is with respect to the rising edge of HRESET. See Figure 3.

5. t

SYS

 is the period of the external clock (SYSCLK) in nanoseconds.

6. These values are guaranteed by design, and are not tested.

7. This specification is for configuration mode only. Also note that HRESET must be held asserted for a minimum of 

255 bus clocks after the PLL relock time (100 

µ

s) during the power-on reset sequence.

Summary of Contents for MPC603EC

Page 1: ...ocessor is an implementation of the PowerPC family of reduced instruction set computer RISC microprocessors This document contains pertinent physical characteristics of the 603 For functional characte...

Page 2: ...ndependent on chip 8 Kbyte two way set associative physically addressed caches for instructions and data and on chip instruction and data memory management units MMUs The MMUs contain 64 entry two way...

Page 3: ...m 8 Kbyte instruction cache two way set associative physically addressed LRU replacement algorithm Cache write back or write through operation programmable on a per page or per block basis BPU that pe...

Page 4: ...ble 1 and Table 2 provide the absolute maximum ratings thermal characteristics and DC electrical characteristics for the 603 Table 1 Absolute Maximum Ratings Characteristic Symbol Value Unit Supply vo...

Page 5: ...ate leakage current Vin 3 465 V1 Vin 5 5 V1 ITSI 10 A ITSI TBD A Output high voltage IOH 9 mA VOH 2 4 V Output low voltage IOL 14 mA VOL 0 4 V Capacitance Vin 0 V f 1 MHz2 excludes TS ABB DBB and ARTR...

Page 6: ...Typical 2 0 mW 2 1 Typical 2 0 2 0 mW Note 1 The values provided for this mode do not include pad driver power OVDD or analog supply power AVDD Worst case AVDD 15 mW Table 5 Clock AC Timing Specificat...

Page 7: ...LK are reached during the power on reset sequence This specification also applies when the PLL has been disabled and subsequently re enabled during sleep mode Also note that HRESET must be held assert...

Page 8: ...for DRTRY QACK and TLBISYNC 0 0 0 0 0 ns 4 6 7 Notes 1 All input specifications are measured from the TTL level 0 8 or 2 0 V of the signal in question to the 1 4 V of the rising edge of the input SYSC...

Page 9: ...CLK frequencies Table 7 Output AC Timing Specifications Vdd 3 3 5 V dc GND 0 V dc CL 50 pF 0 TJ 105 C Num Characteristic 25 33 33 40 50 66 67 Unit Notes Min Max Min Max Min Max Min Max Min Max 12 SYSC...

Page 10: ...s are measured from the 1 4 V of the rising edge of SYSCLK to the TTL level 0 8 V or 2 0 V of the signal in question Both input and output timings are measured at the pin See Figure 4 2 All maximum ti...

Page 11: ...ions REV 2 11 Preliminary Subject to Change without Notice Figure 4 Output Timing Diagram SYSCLK 12 14 13 15 16 16 ALL OUTPUTS Except TS ABB TS ARTRY ABB DBB VM VM VM Midpoint Voltage 1 4 V DBB ARTRY...

Page 12: ...k pulse width measured at 1 4 V 25 ns 3 TCK rise and fall times 0 3 ns 4 TRST setup time to TCK rising edge 13 ns 1 5 TRST assert time 40 ns 6 Boundary scan input data setup time 6 ns 2 7 Boundary sca...

Page 13: ...ary scan timing diagram Figure 7 Boundary Scan Timing Diagram Figure 8 provides the test access port timing diagram Figure 8 Test Access Port Timing Diagram 4 5 TRST TCK 6 7 Input Data Valid 8 9 8 Out...

Page 14: ...152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 OVDD GND OGND CI WT QACK TBEN TLBISYNC RSRV AP0 AP1 OVDD OGND AP2 AP3 CS...

Page 15: ...I O AVDD 209 High Input BG 27 Low Input BR 219 Low Output CI 237 Low Output CLK_OUT 221 Output CKSTP_IN 215 Low Input CKSTP_OUT 216 Low Output CSE 225 High Output DBB 145 Low I O DBDIS 153 Low Input...

Page 16: ...28 138 148 163 173 183 194 222 229 240 High Input PLL_CFG0 PLL_CFG3 213 211 210 208 High Input QACK 235 Low Input QREQ 31 Low Output RSRV 232 Low Output SMI 187 Low Input SRESET 189 Low Input SYSCLK 2...

Page 17: ...that the 603 is currently offered in two types of CQFP packages the Motorola wire bond CQFP and the IBM C4 CQFP 1 6 1 Motorola Wire Bond CQFP Package Description The following sections provide the pac...

Page 18: ...chanical Dimensions of the Motorola Wire Bond CQFP Package Reduced pin count shown for clarity 60 pins per side Min Max A 30 86 31 75 B 34 6 BSC C 3 75 4 15 D 0 5 BSC E 0 18 0 30 F 3 10 3 90 G 0 13 0...

Page 19: ...ameters are as provided in the following list The package type is 32 mm x 32 mm 240 pin ceramic quad flat pack Package outline 32 mm x 32 mm Interconnects 240 Pitch 0 5 mm Lead plating Ni Au Solder jo...

Page 20: ...Figure 11 Mechanical Dimensions of the IBM C4 CQFP Package Reduced pin count shown for clarity 60 pins per side Min Max A 31 8 32 2 B 34 4 34 8 C 3 05 3 15 D 0 45 0 55 E 0 18 0 28 Clip Leadframe Chip...

Page 21: ...d should not exceed 200 MHz 2 In PLL bypass mode the SYSCLK input signal clocks the internal processor directly the PLL is disabled and the bus mode is set for 1 1 mode operation This mode is intended...

Page 22: ...close as possible to their associated Vdd pin Surface mount tantulum or ceramic devices are preferred It is also recommended that these decoupling capacitors receive their power from Vdd and GND powe...

Page 23: ...he device In this environment it can be assumed that all the heat is dissipated to the ambient through the heat sink so the junction to ambient thermal resistance is the sum of the resistances from th...

Page 24: ...Thermal resistance junction to heat sink R js or js 1 1 C Watt junction to heat sink 1 7 6 2 Thermal Management Example The following example is based on a typical desktop configuration using an IBM...

Page 25: ...the reliability limits of the device Notes 1 Junction to ambient thermal resistance is based on modeling 2 Junction to heat sink thermal resistance is based on measurements and model using thermal tes...

Page 26: ...6 provides a detailed description of the IBM part number for the 603 Figure 16 IBM Part Number Key Table 11 Ordering Information for the PowerPC 603 Microprocessor Package Type Internal Frequency Bus...

Page 27: ...follows Heat sink adhesive AIEG 7655 IBM reference drawing 99F4869 Test socket Yamaichi QFP PO 0 5 240P Signal 165 Power ground 75 Total 240 A 1 Package Environmental Operation Shipment and Storage Re...

Page 28: ...mbly process no solvent can be used with the C4FP and no more than 3 Kg of force must be applied normal to the top of the package prior to during or after card assembly Other details of the card assem...

Page 29: ...om side pressure of 44 psig water temperature of 62 5 C 2 5 C dwell time of 48 seconds minimum water flow rate of 350 liters minute Wash chamber 2 top and bottom sprays minimum top side pressure of 32...

Page 30: ...erty rights nor the rights of others Neither Motorola nor IBM makes any claim warranty or representation express or implied that the products described in this manual are designed intended or authoriz...

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