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2

603 Hardware Specifications, REV 2

 

Preliminary—Subject to Change without Notice

 

 

 

1.1  Overview

 

The 603 is the first low-power implementation of the PowerPC microprocessor family of RISC
microprocessors. The 603 implements the 32-bit portion of the PowerPC Architecture™ specification,
which provides 32-bit effective addresses, integer data types of 8, 16, and 32 bits, and floating-point data
types of 32 and 64 bits. For 64-bit PowerPC microprocessors, the PowerPC architecture provides 64-bit
integer data types, 64-bit addressing, and other features required to complete the 64-bit architecture. 

The 603 provides four software controllable power-saving modes. Three of the modes (doze, nap, and sleep
modes) are static in nature, and progressively reduce the amount of power dissipated by the processor. The
fourth is a dynamic power management mode that causes the functional units in the 603 to automatically
enter a low-power mode when the functional units are idle without affecting operational performance,
software execution, or any external hardware.

The 603 is a superscalar processor capable of issuing and retiring as many as three instructions per clock.
Instructions can execute out of order for increased performance; however, the 603 makes completion appear
sequential.

The 603 integrates five execution units—an integer unit (IU), a floating-point unit (FPU), a branch
processing unit (BPU), a load/store unit (LSU), and a system register unit (SRU). The ability to execute five
instructions in parallel and the use of simple instructions with rapid execution times yield high efficiency
and throughput for 603-based systems. Most integer instructions execute in one clock cycle. The FPU is
pipelined so a single-precision multiply-add instruction can be issued every clock cycle. 

The 603 provides independent on-chip, 8-Kbyte, two-way set-associative, physically addressed caches for
instructions and data and on-chip instruction and data memory management units (MMUs). The MMUs
contain 64-entry, two-way set-associative, data and instruction translation lookaside buffers (DTLB and
ITLB) that provide support for demand-paged virtual memory address translation and variable-sized block
translation. The TLBs and caches use a least recently used (LRU) replacement algorithm. The 603 also
supports block address translation through the use of two independent instruction and data block address
translation (IBAT and DBAT) arrays of four entries each. Effective addresses are compared simultaneously
with all four entries in the BAT array during block translation. In accordance with the PowerPC architecture,
if an effective address hits in both the TLB and BAT array, the BAT translation takes priority.

The 603 has a selectable 32- or 64-bit data bus and a 32-bit address bus. The 603 interface protocol allows
multiple masters to compete for system resources through a central external arbiter. The 603 provides a
three-state coherency protocol that supports the exclusive, modified, and invalid cache states. This protocol
is a compatible subset of the MESI (modified/exclusive/shared/invalid) four-state protocol and operates
coherently in systems that contain four-state caches. The 603 supports single-beat and burst data transfers
for memory accesses; it also supports both memory-mapped I/O and direct-store addressing.

The 603 uses an advanced, 3.3-V CMOS process technology and maintains full interface compatibility with
TTL devices.

 

1.1.1  PowerPC 603 Microprocessor Features

 

Major features of the 603 are as follows:

High-performance, superscalar microprocessor 

— As many as three instructions issued and retired per clock

— As many as five instructions in execution per clock 

— Single-cycle execution for most instructions 

— Pipelined FPU for all single-precision and most double-precision operations

Summary of Contents for MPC603EC

Page 1: ...ocessor is an implementation of the PowerPC family of reduced instruction set computer RISC microprocessors This document contains pertinent physical characteristics of the 603 For functional characte...

Page 2: ...ndependent on chip 8 Kbyte two way set associative physically addressed caches for instructions and data and on chip instruction and data memory management units MMUs The MMUs contain 64 entry two way...

Page 3: ...m 8 Kbyte instruction cache two way set associative physically addressed LRU replacement algorithm Cache write back or write through operation programmable on a per page or per block basis BPU that pe...

Page 4: ...ble 1 and Table 2 provide the absolute maximum ratings thermal characteristics and DC electrical characteristics for the 603 Table 1 Absolute Maximum Ratings Characteristic Symbol Value Unit Supply vo...

Page 5: ...ate leakage current Vin 3 465 V1 Vin 5 5 V1 ITSI 10 A ITSI TBD A Output high voltage IOH 9 mA VOH 2 4 V Output low voltage IOL 14 mA VOL 0 4 V Capacitance Vin 0 V f 1 MHz2 excludes TS ABB DBB and ARTR...

Page 6: ...Typical 2 0 mW 2 1 Typical 2 0 2 0 mW Note 1 The values provided for this mode do not include pad driver power OVDD or analog supply power AVDD Worst case AVDD 15 mW Table 5 Clock AC Timing Specificat...

Page 7: ...LK are reached during the power on reset sequence This specification also applies when the PLL has been disabled and subsequently re enabled during sleep mode Also note that HRESET must be held assert...

Page 8: ...for DRTRY QACK and TLBISYNC 0 0 0 0 0 ns 4 6 7 Notes 1 All input specifications are measured from the TTL level 0 8 or 2 0 V of the signal in question to the 1 4 V of the rising edge of the input SYSC...

Page 9: ...CLK frequencies Table 7 Output AC Timing Specifications Vdd 3 3 5 V dc GND 0 V dc CL 50 pF 0 TJ 105 C Num Characteristic 25 33 33 40 50 66 67 Unit Notes Min Max Min Max Min Max Min Max Min Max 12 SYSC...

Page 10: ...s are measured from the 1 4 V of the rising edge of SYSCLK to the TTL level 0 8 V or 2 0 V of the signal in question Both input and output timings are measured at the pin See Figure 4 2 All maximum ti...

Page 11: ...ions REV 2 11 Preliminary Subject to Change without Notice Figure 4 Output Timing Diagram SYSCLK 12 14 13 15 16 16 ALL OUTPUTS Except TS ABB TS ARTRY ABB DBB VM VM VM Midpoint Voltage 1 4 V DBB ARTRY...

Page 12: ...k pulse width measured at 1 4 V 25 ns 3 TCK rise and fall times 0 3 ns 4 TRST setup time to TCK rising edge 13 ns 1 5 TRST assert time 40 ns 6 Boundary scan input data setup time 6 ns 2 7 Boundary sca...

Page 13: ...ary scan timing diagram Figure 7 Boundary Scan Timing Diagram Figure 8 provides the test access port timing diagram Figure 8 Test Access Port Timing Diagram 4 5 TRST TCK 6 7 Input Data Valid 8 9 8 Out...

Page 14: ...152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 OVDD GND OGND CI WT QACK TBEN TLBISYNC RSRV AP0 AP1 OVDD OGND AP2 AP3 CS...

Page 15: ...I O AVDD 209 High Input BG 27 Low Input BR 219 Low Output CI 237 Low Output CLK_OUT 221 Output CKSTP_IN 215 Low Input CKSTP_OUT 216 Low Output CSE 225 High Output DBB 145 Low I O DBDIS 153 Low Input...

Page 16: ...28 138 148 163 173 183 194 222 229 240 High Input PLL_CFG0 PLL_CFG3 213 211 210 208 High Input QACK 235 Low Input QREQ 31 Low Output RSRV 232 Low Output SMI 187 Low Input SRESET 189 Low Input SYSCLK 2...

Page 17: ...that the 603 is currently offered in two types of CQFP packages the Motorola wire bond CQFP and the IBM C4 CQFP 1 6 1 Motorola Wire Bond CQFP Package Description The following sections provide the pac...

Page 18: ...chanical Dimensions of the Motorola Wire Bond CQFP Package Reduced pin count shown for clarity 60 pins per side Min Max A 30 86 31 75 B 34 6 BSC C 3 75 4 15 D 0 5 BSC E 0 18 0 30 F 3 10 3 90 G 0 13 0...

Page 19: ...ameters are as provided in the following list The package type is 32 mm x 32 mm 240 pin ceramic quad flat pack Package outline 32 mm x 32 mm Interconnects 240 Pitch 0 5 mm Lead plating Ni Au Solder jo...

Page 20: ...Figure 11 Mechanical Dimensions of the IBM C4 CQFP Package Reduced pin count shown for clarity 60 pins per side Min Max A 31 8 32 2 B 34 4 34 8 C 3 05 3 15 D 0 45 0 55 E 0 18 0 28 Clip Leadframe Chip...

Page 21: ...d should not exceed 200 MHz 2 In PLL bypass mode the SYSCLK input signal clocks the internal processor directly the PLL is disabled and the bus mode is set for 1 1 mode operation This mode is intended...

Page 22: ...close as possible to their associated Vdd pin Surface mount tantulum or ceramic devices are preferred It is also recommended that these decoupling capacitors receive their power from Vdd and GND powe...

Page 23: ...he device In this environment it can be assumed that all the heat is dissipated to the ambient through the heat sink so the junction to ambient thermal resistance is the sum of the resistances from th...

Page 24: ...Thermal resistance junction to heat sink R js or js 1 1 C Watt junction to heat sink 1 7 6 2 Thermal Management Example The following example is based on a typical desktop configuration using an IBM...

Page 25: ...the reliability limits of the device Notes 1 Junction to ambient thermal resistance is based on modeling 2 Junction to heat sink thermal resistance is based on measurements and model using thermal tes...

Page 26: ...6 provides a detailed description of the IBM part number for the 603 Figure 16 IBM Part Number Key Table 11 Ordering Information for the PowerPC 603 Microprocessor Package Type Internal Frequency Bus...

Page 27: ...follows Heat sink adhesive AIEG 7655 IBM reference drawing 99F4869 Test socket Yamaichi QFP PO 0 5 240P Signal 165 Power ground 75 Total 240 A 1 Package Environmental Operation Shipment and Storage Re...

Page 28: ...mbly process no solvent can be used with the C4FP and no more than 3 Kg of force must be applied normal to the top of the package prior to during or after card assembly Other details of the card assem...

Page 29: ...om side pressure of 44 psig water temperature of 62 5 C 2 5 C dwell time of 48 seconds minimum water flow rate of 350 liters minute Wash chamber 2 top and bottom sprays minimum top side pressure of 32...

Page 30: ...erty rights nor the rights of others Neither Motorola nor IBM makes any claim warranty or representation express or implied that the products described in this manual are designed intended or authoriz...

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