603 Hardware Specifications, REV 2
17
Preliminary—Subject to Change without Notice
Notes:
1. These are test signals for factory use only and must be pulled up to VDD for normal machine operation.
2. OVDD inputs supply power to the I/O drivers and VDD inputs supply power to the processor core. Future
members of the 603 family may use different OVDD and VDD input levels; for example, OVDD = 3.3 V or
5.0 V, with VDD = 2.5 V.
1.6 Package Description
The following sections provide the package parameters and the mechanical dimensions for the 603. Note
that the 603 is currently offered in two types of CQFP packages—the Motorola wire-bond CQFP and the
IBM C4-CQFP.
1.6.1 Motorola Wire-Bond CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola
wire-bond CQFP package.
1.6.1.1 Package Parameters
The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin
ceramic quad flat pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm
TS
149
Low
I/O
TT0–TT4
191, 190, 185, 184, 180
High
I/O
VDD
4, 14, 24, 34, 44, 59, 122, 137, 147, 157,
167, 177, 207
High
Input
WT
236
Low
Output
XATS
150
Low
I/O
Table 9. PowerPC 603 Microprocessor Pinout Listing (Continued)
Signal Name
Pin Number
Active
I/O
