20
603 Hardware Specifications, REV 2
Preliminary—Subject to Change without Notice
1.6.2.2 Mechanical Dimensions of the IBM C4-CQFP Package
Figure 11 shows the mechanical dimensions for the C4-CQFP package.
Figure 11. Mechanical Dimensions of the IBM C4-CQFP Package
*Reduced pin count shown for clarity. 60 pins per side
Min.
Max.
A
31.8
32.2
B
34.4
34.8
C
3.05
3.15
D
0.45
0.55
E
0.18
0.28
Clip Leadframe
Chip
Tape Cast Ceramic
Epoxy Dam
Urethane
Solder-Bump Encapsulant
H
Jmin
Rad
0.08
F
G
A
B
E
Cmax
0.13 TOTAL
s
A-B
C-
0.13 TOTAL
s
A-B
0.08 TOTAL M
A-B
D
-A-
Pin 240
Pin 1
* Not to scale
All measurements in mm
Ang
-B-
