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603 Hardware Specifications, REV 2
Preliminary—Subject to Change without Notice
A.2 Card Assembly Recommendations
This section provides recommendations for card assembly process. Follow these guidelines for card
assembly.
•
This component is supported for aqueous, IR, convection reflow, and vapor phase card assembly
processes.
•
The temperature of packages should not exceed 220
°
C for longer than 5 minutes.
•
The package entering a cleaning cycle must not be exposed to temperature greater than that
occurring during solder reflow or hot air exposure.
•
It is not recommended to re-attach a package that is removed after card assembly.
A.2.1 Card Assembly Process
During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force
must be applied normal to the top of the package prior to, during, or after card assembly. Other details of
the card assembly process follow:
Solder paste
Either water soluble (for example, Alpha 1208) or no clean
Solder stencil thickness
0.152 mm
Solder stencil aperature
Width reduced to 0.03 mm from the board pad width
Placement tool
Panasonic MPA3 or equivalent
Solder reflow
Infrared, convection, or vapor phase
Solder reflow profile
Infrared and/or convection
•Average ramp-up—0.48 to 1.8
°
C/second
•Time above 183
°
C—45 to 145 seconds
•Minimum lead temperature—200
°
C
•Maximum lead temperature—240
°
C
•Maximum C4FP temperature—245
°
C
Vapor phase
•Preheat (board)—60
°
C to 150
°
C
•Time above 183
°
C—60 to 145 seconds
•Minimum lead temperature—200
°
C
•Maximum C4FP temperature—220
°
C
•Egress temperature—below 150
°
C
