2.1.6.5 Heat Dissipation System
The USG6310/6320 has a built-in fan module for heat dissipation.
The device adopts the automatic fan speed adjustment technology to monitor the temperature
of key components. If the internal device temperature is higher than the specified value, the
fan speed increases; when the temperature falls back to its normal range, the fan speed
decreases. In this way, the fan module enables the device to run in normal temperature,
ensuring device running security and reliability.
The device provides a left-to-right air flow, as shown in
. The built-in fan module
locates at the air exhaust and cannot be removed.
Figure 2-25
System air flow
12V ; 3A
Secospace USG6000
0
2
4
6
1
3
5
7
RST
CONSOLE
XXXXXXXXXXXXXXXXXXXXXXXXXXX
Cool air
Hot air
2.1.6.6 Technical Specifications
This section describes the dimensions, weight, and power and environment specifications of
the USG6310/6320.
lists the technical specifications of the USG6310/6320.
Table 2-18
USG6310/6320 Technical Specifications
Item
Description
System specifications
CPU
Multi-core 1.0 GHz processor
Memory
DDR3 2 GB
Flash
16 MB
CF card
1 GB
Hard disk
Not supported
SPUB (the service engine)
Not supported
4G LTE Data Card
Supported
HUAWEI USG6000 Series
Hardware Guide
2 Hardware Overview
Issue 08 (2017-06-30)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
46