Module
Form
Factor
SFP+
SFP+
SFP+
SFP+
SFP+
SFP+
A.3 Requirements for Installation Environment
This section describes the requirements for the USG installation environment, such as the
device position, humidity and temperature, cleanness, antistatic measures, lightning protection
measures, power supply, and anti-magnetic measures.
A.3.1 Device Position
This section describes the USG position requirements to ensure its security.
lists the requirements for the device position.
Table A-16
Device position requirements
Item
Requirement
Ventilation and heat
dissipation
l
To ensure good heat dissipation, keep the air vent of the device
at least 150 mm away from other devices.
l
Ensure that the ventilation and heat dissipation system is
available at the position where the device is to be installed.
Stability
The cabinet or mounting table must be firm enough to support the
weight of the device and its accessories.
Grounding
Ensure that the chassis or mounting table is properly grounded.
A.3.2 Humidity, Temperature, and Cleanness
This section describes the requirements for the humidity, temperature, and cleanness of the
equipment room. To ensure the stability and life cycle of the USG and its components, check
that the equipment room meets the requirements.
Ensure that there is no explosive, conductive, magnetic, or corrosive dust or debris in the
equipment room. Dust that settle on the device may cause electrostatic adsorption, resulting in
poor contact of the metal socket connectors and metal contacts. This shortens the life cycle of
the device and causes faults.
In addition to dust and debris, toxic gases, such as SO
2
, H
2
S, and NH
3
must be cleaned out of
the equipment room.
HUAWEI USG6000 Series
Hardware Guide
A Appendix
Issue 08 (2017-06-30)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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