Removal and replacement procedures 64
CAUTION:
When returning a damaged system board to Hewlett Packard Enterprise, always
install all processor socket covers to prevent damage to the processor sockets and system
board
To remove the component:
1.
Power down the graphics server blade (on page
2.
Remove the graphics server blade ("
3.
Place the graphics server blade on a flat, level work surface.
4.
Remove the access panel ("
Access panel (graphics server blade)
5.
Remove all drives ("
6.
Remove all drive blanks ("
7.
Remove the mezzanine assembly ("
8.
Remove the FlexibleLOM ("
9.
Do one of the following:
o
Remove the storage controller ("
" on page
o
Disconnect the direct connect SATA cable ("
10.
Remove the internal USB drive, if installed. To locate the internal USB connector, see "System
board components (on page
)."
11.
Remove the microSD card, if installed. To locate the microSD card, see "System board
components (on page
)."
12.
Remove all DIMM baffles ("
13.
Remove all DIMMs ("
14.
Remove the front panel/drive cage assembly ("
Front panel/drive cage assembly
15.
Remove the heatsink ("
" on page
16.
Open each of the processor locking levers in the order indicated, and then open the processor
retaining bracket.
CAUTION:
THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY
DAMAGED.
To avoid damage to the system board, do not touch the processor or the
processor socket contacts.
Summary of Contents for ProLiant WS460c Gen9
Page 12: ...Customer self repair 12 ...
Page 13: ...Customer self repair 13 ...
Page 14: ...Customer self repair 14 ...