Hewlett Packard Enterprise ProLiant XL190r Gen10, User Manual

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11
If the component is installed in server 1 and the server is installed in the Apollo r2800 Gen10 Chassis, the removable
blanks must be installed in drive bays 1-3, 1-4, 2-1, 2-2, 2-3 and 2-4 . If the component is installed in server 3 and the
server is installed in the Apollo r2800 Gen10 Chassis, the removable blanks must be installed in drive bays 3-3, 3-4,
4-1, 4-2, 4-3 and 4-4. For more information, see
Installing drive blanks and thermal bezel blanks for components
with thermal limitations on page 23.
Thermal limitations for components in systems with the Enhanced
Processor Performance feature disabled
Processors
The following limitations are for the Intel Xeon Gold 6244 (G6244) processor:
• The processor does not support enhanced processor performance.
• LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo r2200
Gen10 Chassis series with three drives per node.
Description Chassis Fan configuration Number of drives
supported by the
server
Maximum inlet
ambient
temperature
Processor with
a TDP of 150
W, except
G6244 Apollo r2200
Gen10 Chassis
(12 LFF
backplane)
Redundant and
nonredundant 5 to 6 drives
1
25°C (77°F)
5 to 6 drives
2
25°C (77°F)
0 to 4 drives
3
30°C (86°F)
Apollo r2600
Gen10 Chassis
(24 SFF or 16
SFF + 8 NVMe
backplane)
Redundant and
nonredundant 0 to 10 drives
30°C (86°F)
Apollo r2800
Gen10 Chassis
(24 SFF
backplane with
SAS expander)
Redundant and
nonredundant 0 to 24 drives
30°C (86°F)
Apollo r2800
Gen10 Chassis
(16 NVMe
backplane)
Redundant and
nonredundant 0 to 8 drives
35°C (95°F)
Intel Xeon Gold
6244 (G6244)
processor Apollo r2200
Gen10 Chassis
(12 LFF
backplane)
Redundant and
nonredundant 5 to 6 drives
1
22°C (71.6°F)
5 to 6 drives
2
Not supported
0 to 4 drives
3
28°C (82.4°F)
Table Continued
158 Specifications