Epson Research and Development
Page 19
Vancouver Design Center
Hardware Functional Specification
S1D13503
Issue Date: 01/01/29
X18A-A-001-08
Figure 9: S1D13503D00A Pad Diagram
Note
* Pad 97 = WF in all display modes except format 1 for 8-bit single color panel.
* Pad 97 = XSCL2 in format 1 for 8-bit single color panel.
DB7
V
SS
V
DD
DB
8
DB
9
DB
1
0
DB
1
1
DB
1
2
DB
1
3
DB
1
5
AB
0
AB
1
AB
2
AB
3
AB
4
AB
5
AB
6
AB
7
AB
8
AB
9
AB
1
0
AB
1
1
AB
1
2
AB
1
3
DB
1
4
AB
1
4
AB
1
5
AB
1
6
AB
1
7
AB
1
8
AB19
VA0
VA1
VA2
VA3
VA4
VA5
VA6
VA7
VA8
VA9
VA10
VD0
VD1
VD2
VD3
VD4
VD5
VD6
RESET
WF/XSCL2*
LP
YD
LD0
LD1
LD2
LD3
UD0
UD1
UD2
UD3
VC
S1
#
VC
S0
#
VW
E
#
VA
1
5
VA
1
4
VA
1
3
VA
1
2
VA
1
1
VD1
5
VD1
4
VD1
3
VD1
2
VD1
1
VD1
0
VD9
VD8
V
DD
V
SS
VD7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
OSC2
OSC1
BHE#
READY
MEMR#
MEMW#
MEMCS#
IOR#
IOW#
IOCS#
VOE#
LCDENB
XSCL
1
10
20
30
40
50
60
70
80
90
100
Dummy Pad
Dummy Pad
Chip Size
Chip Thickness
Pad Size
Pad Pitch
5.030 mm x 5.030 mm
0.400 mm
0.090 mm x 0.090 mm
0.126 mm (Min.)
=
=
=
=
S1D13503D00A
110
120
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