EPSON LX-300+II/300+II RTP/1170II
Revision D
Disassembly and Assembly
Disassembly and Assembly
74
4.2.5 Main Board Assembly Removal
1. Remove the upper housing. (See 4.2.2 “Upper Housing Unit Removal”.)
2. Remove the printer mechanism. (See 4.2.3 “Printer Mechanism Removal”.)
3. LX-1170II: Remove 1 screw (C.B.P., Tite, 3x10 F/ZN; Torque 0.78-0.98 N.M.)
and the right grounding plate.
Figure 4-7. Right Grounding Plate Removal (LX-1170II)
4. Remove 2 Jack Sockets (Torque 0.29-0.49 N.M.) securing the serial interface
connector to the lower shield plate.
5. Remove the serial interface connector from the installation hole of the lower shield
plate.
6. Remove 2 screws (C.P., Screw, 3x4 F/ZN; Torque 0.48-0.78 N.M.) securing the
parallel interface to the lower shield plate.
7. Disconnect the option FFC (LX-300+II only) and panel FFC from CN12 and CN13 on
the board.
8. Disconnect the harness connected to the Power Supply Board Assembly from CN8.
Press one edge of CN8 in order to remove or install the harness.
9. Remove 3 screws (C.B.P., Tite, 3x10 F/ZN) securing the main board assembly to the
lower housing.
Figure4-8. C640/641MAIN Board Assembly Removal
Grounding Plate, Right
C.B.P., Tite, 3x10 F/ZN
A D J U S T M E N T
R E Q U I R E D
When the main board assembly is replaced, perform the destination
setting, Bi-D adjustment, top margin adjustment, and bottom margin
adjustment.
Main Board Assembly
CN8
C.B.P., Tite, 3x10 F/ZN
C.B.P., Tite, 3x10 F/ZN
C.B.P., Tite, 3x10 F/ZN
Lower Shield Plate
CN13
CN12
C.P., Screw, 3x4 F/ZN
Hexagon Nut
Summary of Contents for cLX-300+II RTP
Page 8: ...C H A P T E R 1 PRODUCTDESCRIPTION ...
Page 42: ...C H A P T E R 2 OPERATINGPRINCIPLES ...
Page 56: ...C H A P T E R 3 TROUBLESHOOTING ...
Page 65: ...C H A P T E R 4 DISASSEMBLYANDASSEMBLY ...
Page 85: ...C H A P T E R 5 ADJUSTMENT ...
Page 92: ...C H A P T E R 6 MAINTENANCE ...
Page 97: ...C H A P T E R 7 LX 300 IIRTP ...
Page 110: ...APPENDIX ...
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