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entegris A192-80M-0215, Installation And Use Manual

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200 MM WAFER CARRIER INTERFACE

10 

 INSTALLATION AND USE MANUAL 

ENTEGRIS, INC.

Contact Areas B and C

Track Length (#2 on previous diagram)

D6a: Inside Track Width

The depth of the recess for the wafer carrier track 
should be a maximum of 6.4 mm (0.25").

Four Point Track Contact

Ensure the wafer carrier is supported only on the 
four points of the track to ensure proper orienta-
tion. Please see page 6 for more information.

Interface Points: 

Robotic Handling 

General Recommendations

When developing interfaces to robotic handling  
features, it is important to reference the specifi- 
cations for the specific wafer carrier as features  
vary in design and location. If additional informa-
tion is required, contact Entegris Applications 
Engineering.

Robotic Handling Features

Entegris provides many different features  
to  facilitate robotic handling. The following  
general categories of robotic handling features  
are detailed below.

• Endwall flanges

• “H” bar end flanges

• Endwall handle

• Top flanges

Endwall Flanges

Robotic flanges on a wafer carrier endwall are  
available in many styles including outboard and 
inboard flanges. Outboard flanges are near the 
outer edges of the wafer carrier. Inboard flanges  
are in towards the center of the end wall.

The controlled dimension (#1) for end wall flanges 
is the overall length from Datum A to the inside 
(backside) of the flange.

6.35 mm 

(0.256”) 

maximum

D6a

Interface

plate

Endwall Flanges

Inboard flanges

Outboard flanges

Endwall Flange Controlled Dimension

#1

Summary of Contents for A192-80M-0215

Page 1: ...CRITICAL MATERIALS HANDLING D1 B2 D3b Datum A B3 B B D3a Installation and use manual 200 MM WAFER CARRIER INTERFACE MANUAL ...

Page 2: ...e Interface Plate 9 Contact Area A 9 Contact Areas B and C 10 Interface Points Robotic Handling 10 General Recommendations 10 Robotic Handling Features 10 Endwall Flanges 10 H Bar End Flanges 11 Endwall Handle 11 Top Flanges 11 Material Information 12 Material Properties and Equipment Interface 12 Static Protection 12 Moisture Absorption 12 Applications 12 Wafer Transport Carriers 12 Process Wafer...

Page 3: ...Pocket size inside pocket across to inside pocket MACHINE FIT SPECIFICATIONS D1 Distance from Datum A to the center line of the first pocket D3a Distance from Datum A to the front of the H bar at the center of the carrier D3b Distance from Datum A to the front of the H bar 13 mm 0 5 from the side of the carrier D4a Distance from Datum B to the center line of the H bar D4b Distance from Datum B to ...

Page 4: ...d while positioned on its track Overall size Overall size is measured by length by width by height as shown in the diagram Pin height is not included in the height measurement for wafer carriers Pin The mass of material which enters the hole or slot of another carrier for transferring wafers Pocket The area in which the wafer is located in the carrier Pocket flat The width of the pocket along the ...

Page 5: ...educed equipment shut downs Minimized damage or breakage of wafers Reduced particle generation caused by wafers rubbing on carriers General Definitions The following definitions define and clarify the wafer plane concept Wafer plane The position of the wafer in a carrier Wafer plane zone The acceptable position for a wafer defined by the offset dimension and tolerance Pocket center plane The imagi...

Page 6: ...r each specific pocket in a wafer carrier It can be calculated with the following formulas Y X Offset Tolerance Z X Offset Tolerance Where Y Top limit of the wafer plane zone for pocket N Z Bottom limit of the wafer plane zone for pocket N X Pocket center plane distance for pocket N NOTE The offset value is given as a negative value Please use the absolute or non negative value in the above calcul...

Page 7: ...carrier stage and or H bar nest should be designed to provide planar support for all four points Wafer Carriers Included and Exceptions Most 200 mm carriers have a four point contact feature on both the H bar end and the track with the following exceptions The Entegris wafer carriers listed below do not have a four point contact feature on either the H bar end or the track They should be supported...

Page 8: ...ed interface plates can greatly reduce particle generation The use of radius edges and smooth surfaces on areas that interface the wafer carrier will reduce the number of particles generated by abrasion of the wafer carrier Interface Points Wafers Horizontal General Recommendations Entegris strongly recommends that only the contact points detailed in this section be used to locate wafer carriers f...

Page 9: ...carrier Four Point H Bar Contact Ensure the wafer carrier is supported only on the four points of the H bar contact to ensure proper height to pocket D1 Please see page 7 for more information Contact Area C When designing an Area C interface use the following dimensions D6a Inside Track Width D4a Cross Bar Centerline The interface location should be within 9 5 mm 0 38 of the wafer carrier track Fo...

Page 10: ...the most accurate wafer carrier registration for vertical handling D9a D9b D9c D9e Center Notch Location 1 The center of the center notches on 200 mm wafer carriers measured from Datum A are 25 Capacity 101 6 mm 4 00 26 Capacity 104 8 mm 4 13 The center of the center notch may not be at the center of the track length 1 For 25 capacity wafer carriers the center notches on the wafer carrier track Da...

Page 11: ... and location If additional informa tion is required contact Entegris Applications Engineering Robotic Handling Features Entegris provides many different features to facilitate robotic handling The following general categories of robotic handling features are detailed below Endwall flanges H bar end flanges Endwall handle Top flanges Endwall Flanges Robotic flanges on a wafer carrier endwall are a...

Page 12: ...nce with the inside H bar surface Endwall Handle Endwall handles are placed towards the center of the endwall and above the center of gravity of the carrier Top Flanges Top flanges run along the top length of the wafer carrier parallel to the track Use of the top flanges for robotic movement and placement of the wafer carrier is acceptable only when precise placement is not required H bar End Flan...

Page 13: ...Wafer Transport Carriers Wafer transport carriers are used to store and transport wafers throughout the production process They offer limited chemical resistance and should not be used with harsh chemicals Standard Material Definitions STAT PRO 9000 Material STAT PRO 9000 black static dissipative material is a blend of Carbon Nanotube CNT enhanced polyetheretherketone PEEKTM polymer carbon compoun...

Page 14: ... EMSTAT AR 10 5 1010 ohms sq 0 01 sec STAT PRO 100 10 3 10 8 ohms sq 0 01 sec Blue polypropylene 1013 ohms sq 30 sec Natural PFA 1013 ohms sq Not applicable Moisture Absorption Test method ASTM 570 Material Water Absorption STAT PRO 9000 0 04 STAT PRO 3000 0 05 EMSTAT AR 0 01 STAT PRO 100 0 02 Blue polypropylene 0 02 Natural PFA 0 03 Temperature Limits Material Maximum Continuous Use Temperature M...

Page 15: ... All rights reserved Printed in USA 1210 0469ENT 1215 For More Information Please call your Regional Customer Service Center today to learn what Entegris can do for you Visit www entegris com and select the Customer Service link for the center nearest you Terms and Conditions of Sale All purchases are subject to Entegris Terms and Conditions of Sale To view and print this information visit www ent...

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