Package Information
© 2011 Advanced Micro Devices, Inc.
46136 AMD RX881 Databook 1.40
Proprietary
5-5
5.3
Package Information
5.3.1
Physical Dimensions
Figure 5-1
and
Table 5-6
describe the physical dimensions of the RX881 package.
Figure 5-2
shows the detailed
ball arrangement for the RX881.
Figure 5-1 RX881 528-Pin FCBGA Package Outline
Table 5-6 RX881 528-Pin FCBGA Package Physical Dimensions
Ref.
Min(mm)
Typical (mm)
Max. (mm)
c
0.48
0.58
0.68
A
1.69
1.84
1.99
A1
0.30
0.40
0.50
A2
0.81
0.86
0.91
b
0.40
0.50
0.60
D1
20.85
21.00
21.15
D2
-
8.58
-
D3
2.00
-
-
D4
1.00
-
-
E1
20.85
21.00
21.15
E2
-
7.70
-
E3
2.00
-
-
E4
1.00
-
-
F1
-
19.20
-
F2
-
19.20
-
e1
-
0.80 (min. pitch)
-
ddd
-
-
0.20
Note
: Maximum height of SMT components is 0.650 mm.
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