
BA Intellidrive User’s Manual
Technical Details
Version 1.4
Aerotech, Inc.
7-23
Figure 7-21.
Preferred Mounting of BAI Amplifiers (10/20/30/50)
7.7.2. Mounting Procedures for the BAI 75/100
To ensure proper heat dissipation, Aerotech recommends the following procedures:
1.
Use the mounting procedure shown in Figure 7-22. The wider part of the amp should
be mounted to the heat sink.
2.
Heat sink should be at least 2 feet
2
x 0.25” thick minimum.
3.
The heat sink should be free of paint or any other thermal
ba
rrier.
4.
The heat sink must be flat to allow good thermal conductivity between the heat sink
and the amplifier.
5.
If possible, add a thermal conductivity enhancer (i.e., thermal grease between the
heat sink and the amplifier).
6.
Adding an external fan (already included in the BAI 100) will remove a considerable
amount of heat from the heat sink and allow the amplifier to operate at a much cooler
temperature.
Metal Panel
(Preferred mounting for better heat dissipation)
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