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Document #800-0351-001 Rev B
Page 19
ZS COMP INSTALLATION MANUAL FOR COMPOSITION SHINGLE ROOFS - U.S.
4.3.2 Special Grounding Component Options
Zep Solar, Inc. offers grounded versions of some components (Hybrid Interlock, Leveling Foot,
Groove Adapter Kit) in selected markets as required by national codes and standards. All of these
components are built around a “Grounding Rockit” which is a Rockit with a grounding feature on
the Key side.
Hybrid Interlocks and Grounding.
Zep Solar, Inc. offers two versions of the Hybrid Interlock.
National code requirements determine which component is available within each country. If an
installed layout has a continuous column of Hybrid Interlocks, and the grounded version is not
available, a Ground Zep must be installed on either side of that column.
Ground Zep Module Limit.
A single Ground Zep can ground up to 72 modules
4.4 Thermal Expansion
There are two methods to address thermal expansion and contraction within Zep Compatible
arrays: Thermal Expansion Joints and physical gaps or breaks between sub-arrays.
Thermal Expansion Joints consist of Interlocks that are installed in a manner that allows modules
to slide back and forth as they expand and contract in response to daily temperature swings on the
roof. This allows the modules some added flexibility to expand in the direction that the Interlocks
are running. In the other direction (North-South in the case of ZS Comp), a physical gap is required
to allow for thermal expansion of the modules. Generally, a gap of at least 12” between sub-arrays
is recommended, both for thermal expansion and to allow access by work crews for module ser-
vicing.
4.4.1 When Are Thermal Expansion Joints Needed?
Thermal expansion must be addressed under the following conditions:
•
Array sizes larger than 10 meters or approximately 33 feet in either direction.
•
After two consecutive Thermal Expansion Joints, a physical gap is required.
For example, a typical 60-cell polycrystalline module would require thermal expansion every 6
module lengths or 10 module widths, or approximately every 60 modules assuming a square array.
4.4.2 Installing Thermal Expansion Joints
Thermal Expansion Joints use the Interlock component, which is used to connect and bond two
modules together. To create a Thermal Expansion Joint between two modules, rotate the Inter-
lock Zep on one side to Position 3 (locked position) using the Zep Tool. Rotate the Interlock Zep on
the other side to Position 2. Position 2 provides a structural connection, but does not establish an
electrical bond.This allows the module on the side of Position 2 to slide back and forth as the mod-
ules expand and contract in changing temperatures.
NOTE:
Thermal Expansion Joints require that a Ground Zep be installed on both sides
of the break.
