SE868Kx-Ax Family Product User Guide
1VV0301201 Rev. 5
Page 68 of 83
2021-07-15
Not Subject to NDA
Reflow
The modules are compatible with lead free soldering processes as defined in IPC/JEDEC
J-STD-020. The reflow profile must not exceed the profile given IPC/JEDEC J-STD-020
Table 5-
2, “Classification Reflow Profiles”.
Note: Although IPC/JEDEC J-STD-020 allows for three reflows, the
assembly process for the module uses one of those profiles, therefore
the module is limited to two reflows.
When re-flowing a dual-sided SMT board, it is important to reflow the side containing the
module last. This prevents heavier components within the module from becoming
dislodged if the solder reaches liquidus temperature while the module is inverted.
Note: JEDEC standards are available free from the JEDEC website
The recommended reflow profile is shown in the following figure:
Figure 28: SE868 Family Recommended Reflow Profile