SE868Kx-Ax Family Product User Guide
1VV0301201 Rev. 5
Page 65 of 83
2021-07-15
Not Subject to NDA
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these electronic
devices to avoid damage from moisture absorption. If localized heating is required to
rework or repair the device, precautionary methods are required to avoid exposure to
solder reflow temperatures that can result in performance degradation or damage.
Note: The module has a moisture sensitivity level rating of 3 as defined
by IPC/JEDEC J-STD-020.
This rating is assigned due to some of the components used within the
module.
Please follow the MSD and ESD handling instructions on the labels of the MBB and
exterior carton.
The modules are supplied in a hermetically sealed bag with desiccant and humidity
indicator cards. The parts must be placed and reflowed within 168 hours of first opening
the hermetic seal provided the factory conditions are less than 30°C and less than 60%
and the humidity indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then
the parts will need to be baked prior to reflow. The parts may be baked at +125°C ± 5°C
for 48 hours.
Warning: However, the packaging materials (tape and reel or trays)
can NOT withstand that temperature.
Lower temperature baking is feasible if the humidity level is low and
time is available.
Additional information can be found on the MSL tag affixed to the outside of the
hermetically sealed bag and IPC/JEDEC J-STD-033.
Note: JEDEC standards are available free of charge from the JEDEC
website
