UM-B-041
SmartBond Production Line Tool
User Manual
Revision 4.8
02-Nov-2022
CFR0012
122 of 170
© 2022 Renesas Electronics
Appendix D Application Hardware Design Considerations
When the Production Line Tool (PLT) is used, one should be aware of the following items:
●
One could consider adding additional pads to the design for future debugging, not related to PLT,
like pins for SWD
●
Pads are, in most cases, placed on the rear side of the circuit board. They should be gold plated.
Dimensions of these pads are crucial and have to do with the stability and accuracy of the pogo-
pins that connect to the PLT HW. They should not be designed too critical. Long pogo pins might
bend during production testing
●
Optionally, holes can be added for guiding-pins that fit on the test jig used for the PCB or panel
●
Orientation of the antenna used on the application board will impact the RSSI-value.
When panels are used, this RSSI will vary, dependent on the distance to the GU antenna on the
PLT. In the PLT software an RSSI-offset can be added for each DUT location to compensate for
these differences
More reference documentation is available on Renesas website:
AN-B-087: DA1470x HW Guidelines
https://www.renesas.com/eu/en/document/apn/b-087-
da1470x-hw-guidelines?language=en&r=1614971