UMTS/HSPA+ Module Series
UG89 Hardware Design
UG89_Hardware_Design 63 / 73
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the 2D barcode is still readable, although white rust may be found.
7.3. Packaging
UG89 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
Soak time (between A and B: 150°C and 200°C)
60 to 120 sec
Reflow Zone
Max slope
2 to 3°C/sec
Reflow time (D: over 220°C)
40 to 60 sec
Max temperature
238°C ~ 245°C
Cooling down slope
1 to 4°C/sec
Reflow Cycle
Max reflow cycle
1
NOTES