UMTS/HSPA+ Module Series
UG89 Hardware Design
UG89_Hardware_Design 46 / 73
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Figure 22: Microstrip Design on a 2-layer PCB
Figure 23: Coplanar Waveguide Design on a 2-layer PCB
Figure 24: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)