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6.5.2. Packaging Process

Each blister tray packs 15 modules. Stack

10 blister trays with modules together, and put

1 empty blister tray on the top.

Packing 11 blister trays together and then put

blister trays into conductive bag, seal and

pack the conductive bag.

Put the seal-packed blister trays into the mini box.

1 mini box can pack 150 modules.

Put 4 packaged mini boxes into 1 carton box

and then seal it. 1 carton box can pack

600 modules.

Figure 33: Packaging Process

Содержание EM160R-GL

Страница 1: ...EM160R GL Hardware Design LTE A Module Series Version 1 3 3 Date 2023 10 18 Status Preliminary...

Страница 2: ...employ commercially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available...

Страница 3: ...implement module functionality certain device data are uploaded to Quectel s or third party s servers including carriers chipset suppliers or customer designated servers Quectel strictly abiding by t...

Страница 4: ...e interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Terminals or mobiles operat...

Страница 5: ...ough FULL_CARD_POWER_OFF Figure 8 Updated the figure of turn off timing through AT command and power supply Figure 10 Updated the figure of reset timing Figure 14 Updated the description of reset timi...

Страница 6: ...stomer which more intuitively shows the process of the module from D3cold to D0 state Iyukee SHEN Updated reference circuit of DPR Chapter 3 9 5 To prevent customers from directly connecting which may...

Страница 7: ...e risk points Fung ZHU Added related note description of RESET Chapter 3 5 Optimize the description and reduce risk points Fung ZHU Added related note description in U SIM design notices Chapter 3 6 4...

Страница 8: ...3 3 Power Supply 24 3 3 1 Voltage Stability Requirements 24 3 3 2 Reference Design for Power Supply 25 3 4 Turn On Turn Off and Reset Scenarios 26 3 4 1 Turn On 26 3 4 2 Turn Off 28 3 5 RESET 29 3 6 U...

Страница 9: ...onnector Location 54 4 3 2 Antenna Connector Specifications 55 4 3 3 Antenna Connector Installation 56 4 4 Antenna Requirements 58 5 Electrical Characteristics and Reliability 59 5 1 Absolute Maximum...

Страница 10: ...the WAKE_ON_WAN 42 Table 20 Function of the DPR Signal 42 Table 21 Pin Definition of ANT_CONFIG 43 Table 22 Pin Definition of COEX UART 44 Table 23 Pin Definition of Antenna Tuner Control Interface t...

Страница 11: ...160R GL_Hardware_Design 10 73 Table 42 EM160R GL Power Consumption 61 Table 43 Electrostatic Discharge Characteristics Temperature 25 30 C Humidity 40 5 64 Table 44 Related Documents 72 Table 45 Terms...

Страница 12: ...5 PCIe Interface Reference Circuit EP Mode 37 Figure 16 PCIe D3Cold State Timing 38 Figure 17 Reference Design of W_DISABLE1 and W_DISABLE2 40 Figure 18 Reference Design of WWAN_LED 41 Figure 19 Refer...

Страница 13: ...electrical and mechanical details as well as other related information of the module This document coupled with application notes and user guides makes it easy to design and set up mobile application...

Страница 14: ...so on it indicates that the function feature interface pin AT command argument and so on is under development and currently not supported and the asterisk after a model indicates that the sample of t...

Страница 15: ...on demands The following table shows the frequency bands and GNSS functions of the module Table 2 Frequency Bands and GNSS Functions of EM160R GL 1 GNSS function is optional 2 LTE FDD B29 B32 and LTE...

Страница 16: ...ther Bands Class 3 24 dBm 1 dB LTE Features Supports FDD and TDD Supports CA Categories Supports up to UL CA Cat 13 Supports up to DL CA Cat 16 Supports 1 4 3 5 10 15 20 MHz RF bandwidths Supports 4 4...

Страница 17: ...go a reduction in value exceeding the specified tolerances of 3GPP When the temperature returns to the normal operating temperature level the module will meet 3GPP specifications again SMS cell broadc...

Страница 18: ...ress M 2 Key B Interface FULL_CARD_POWER_OFF W_DISABLE2 WWAN_LED WAKE_ON_WAN RFFE W_DISABLE1 MIMO2 GND RESET VCC SPMI BB_CLK 19 2MHz RF_CLK 38 4MHz EBI1 EBI2 PMIC 4Gb 8 bit NAND Flash 2Gb 16 bit LPDDR...

Страница 19: ...levels of EM160R GL comply with PCI Express M 2 specifications This chapter mainly describes the definition and application of the following interfaces signals pins of EM160R GL Power supply U SIM int...

Страница 20: ...43 PCIE_TX_M 41 GND 39 RESERVED 37 RESERVED 35 GND 33 RESERVED 31 RESERVED 29 GND 27 DPR 25 WAKE_ON_WAN 23 CONFIG_0 21 Notch Notch Notch Notch GND 11 RESERVED 9 RESERVED 7 GND 5 GND 3 CONFIG_3 1 PIN1...

Страница 21: ...Parameter Description AI Analog Input AO Analog Output AIO Analog Input Output DI Digital Input DO Digital Output DIO Digital Input Output OD Open Drain PI Power Input PO Power Output PU Pull Up PD Pu...

Страница 22: ...otch 14 Notch Notch 15 Notch Notch 16 Notch Notch 17 Notch Notch 18 Notch Notch 19 Notch Notch 20 RESERVED Reserve for PCM clock 21 CONFIG_0 DO Connected to GND internally 22 RESERVED Reserve for PCM...

Страница 23: ...fferential impedance of 95 42 NC NC 43 PCIE_TX_P AO PCIe transmit Requires differential impedance of 95 44 NC NC 45 GND Ground 46 NC NC 47 PCIE_RX_M AI PCIe receive Requires differential impedance of...

Страница 24: ...xistence transmit 1 8 V 65 ANTCTL3 DO Antenna tuner control 1 8 V 66 USIM_DET DI U SIM card hot plug detect 1 8 V 67 RESET DI PU Reset the module 1 8 V Active low A test point is recommended to be res...

Страница 25: ...bypass capacitor of about 220 F with low ESR should be used and a multi layer ceramic chip capacitor MLCC array should also be reserved due to its ultra low ESR It is recommended to use four ceramic...

Страница 26: ...least The following figure shows a reference design for 5 0 V input power source The typical output of the power supply is about 3 7 V D1 TVS PWR_IN C8 220 F C11 10 pF C10 33 pF C9 100 nF R1 205K U1 Q...

Страница 27: ...the following figure Host Module FULL_CARD_POWER_OFF PMU GPIO 6 1 8 V or 3 3 V NOTE The voltage of pin 6 should be not less than 1 19 V when it is at high level R1 100K G S D Figure 6 Turn on the Mod...

Страница 28: ...lity in PCIe interface will be caused For the laptop platform if there are two reset signals to control PERST pin of the module and the following figure is for reference It is recommended that AUX Res...

Страница 29: ...1 19 V T3 Active Turn off procedure OFF PERST T1 T2 Execute AT CFUN 0 and the module responds OK Figure 9 Turn off Timing through FULL_CARD_POWER_OFF Table 9 Description of the Turn off Timing throug...

Страница 30: ...m drivers It will also disconnect the modem from the network Table 10 Pin Definition of RESET An open collector drain driver or button can be used to control the RESET pin Host Module RESET GPIO 67 Re...

Страница 31: ...after reset a system pause will be caused Host 1 VCC of the system should supply power continuously and FULL_CARD_POWER_OFF should be kept at high level Index Min Typ Max Comment T1 15 ms The period...

Страница 32: ...quirements Both 1 8 V and 3 0 V U SIM cards are supported and Dual SIM Single Standby function is supported Table 12 Pin Definition of U SIM Interface 3 6 1 U SIM Hot Plug The module supports U SIM ca...

Страница 33: ...card connector USIM_DET pin is shorted to ground when there is no U SIM card inserted U SIM card detection by high level is applicable to this type of connector Once AT QSIMDET U SIM Card Detection T...

Страница 34: ...apacitors and TVS array should be close to U SIM card connector in PCB layout The external pull up resistor of USIM_DATA is optional 20K 22R 22R 22R 33 pF 33 pF 33 pF 100 nF USIM_VDD 10 k Figure 12 Re...

Страница 35: ...g If U SIM card hot plug is not needed please keep USIM_DET unconnected A reference circuit for U SIM card interface with a 6 pin U SIM card connector is illustrated by the following figure Module U S...

Страница 36: ...erface Pin No Pin Name I O Description Comment 55 PCIE_REFCLK_P AIO PCIe reference clock Requires differential impedance of 95 53 PCIE_REFCLK_M AIO PCIe reference clock 49 PCIE_RX_P AI PCIe receive da...

Страница 37: ...Module PCIE_REFCLK_P PCIE_REFCLK_M PCIE_RX_P PCIE_RX_M PCIE_TX_P PCIE_TX_M BB PCIE_REFCLK_P PCIE_REFCLK_M PCIE_RX_P PCIE_RX_M PCIE_TX_P PCIE_TX_M 55 53 49 47 43 41 CLKREQ PERST PEWAKE CLKREQ PERST PEW...

Страница 38: ...m Keep the length matching of each differential data pair Tx Rx less than 0 7 mm for PCIe routing traces Keep the differential impedance of PCIe data trace as 95 10 You must not route PCIe data traces...

Страница 39: ...g Table 14 Exit D3cold State Timing of the Module 3 8 Control and Indication Interfaces Table 15 Pin Definition of Control and Indication Interfaces Symbol Min Typ Max Comment Texit 50 ms 150 ms 500 m...

Страница 40: ...E2 pin used to disable or enable the GNSS function The W_DISABLE2 pin is pulled up by default Driving it low will disable the GNSS function The combination of W_DISABLE2 pin and AT commands can contro...

Страница 41: ...are active low and a reference circuit is shown below Host Module W_DISABLE2 W_DISABLE1 BB GPIO GPIO 26 8 VDD 1 8 V NOTE Host s GPIO could be a 1 8 V or 3 3 V voltage level R2 10K R1 10K VCC_IO_HOST...

Страница 42: ...74 VCC Figure 18 Reference Design of WWAN_LED Table 18 RF Status Indications of WWAN_LED RF function is turned off if any of the following circumstances occurs The U SIM card is not working W_DISABLE...

Страница 43: ...t side due to open drain in pin 23 Wake up the host 1 s H L R1 10K Figure 19 Reference Design of WAKE_ON_WAN 3 8 5 DPR EM160R GL provides a DPR Dynamic Power Reduction signal for body SAR Specific Abs...

Страница 44: ...ls about AT QCFG sarcfg 3 8 6 ANT_CONFIG EM160R GL provides an ANT_CONFIG pin for antenna configuration The signal of the pin is sent from host system to the module ANT_CONFIG is an input port which i...

Страница 45: ...be routed to an appropriate antenna control circuit More details about the interface will be added in a future version of the document 3 10 1 Antenna Tuner Control Interface through GPIOs Table 23 Pin...

Страница 46: ...pins which are defined as below Table 25 Configuration Pins of the Module Pin Name Pin No I O Description Comment RFFE_CLK 56 DO Used for external MIPI IC control If unused keep them open RFFE_DATA 5...

Страница 47: ...100K R3 100K R4 100K 0 NM 0 NM 0 0 Note The voltage level VCC_IO_HOST depends on the host side and could be a 1 8 V or 3 3 V voltage level Figure 21 Recommended Circuit of EM160R GL Configuration Pins...

Страница 48: ...one main antenna interface one Rx diversity antenna interface two MIMO antenna interfaces and one GNSS antenna interface They are used to resist the fall of signals caused by high speed movement and m...

Страница 49: ...WCDAM B19 830 845 875 890 MHz LTE FDD B1 1920 1980 2110 2170 MHz LTE FDD B2 1850 1910 1930 1990 MHz LTE FDD B3 1710 1785 1805 1880 MHz LTE FDD B4 1710 1755 2110 2155 MHz LTE FDD B5 824 849 869 894 MH...

Страница 50: ...Rx Sensitivity values are measured in dual antennas condition Primary Diversity For single primary antenna without Diversity the sensitivity will drop around 3 dBm for each LTE band 8 The RB configura...

Страница 51: ...0 MHz LTE FDD B14 101 8 93 3 10 MHz LTE FDD B18 102 96 3 10 MHz LTE FDD B19 102 96 3 10 MHz LTE FDD B20 102 1 93 3 10 MHz LTE FDD B25 100 3 92 8 10 MHz LTE FDD B26 101 9 93 8 10 MHz LTE FDD B28 101 9...

Страница 52: ...the module 10 The test result is based on CA_20A 32A Frequency Band Rx Sensitivity Typical dBm 7 3GPP dBm Comment 8 LTE FDD B1 103 5 99 10 MHz LTE FDD B2 103 97 10 MHz LTE FDD B3 102 8 96 10 MHz LTE...

Страница 53: ...about GNSS engine technology and configurations see document 4 Table 32 GNSS Frequency 11 For B41 HPUE based on the power reduction of QPSK 25 5 dBm 1 1 5 dB the power tolerance of 16QAM and 64QAM is...

Страница 54: ...enabled 7 07 s Hot start open sky Autonomous 2 12 s XTRA enabled 2 6 s Accuracy CEP 50 Autonomous open sky 2 m 1 Tracking sensitivity the minimum GNSS signal power at which the module can maintain lo...

Страница 55: ...Connectors 4 3 1 Antenna Connector Location The module has four antenna connectors main Rx diversity GNSS MIMO1 and MIMO2 which are shown below MIMO2 Antenna Rx diversity GNSS Antenna MIMO1 Antenna Ma...

Страница 56: ...onvenient antenna connection The connector dimensions are illustrated below Figure 23 Dimensions of the Receptacle Unit mm Table 34 Major Specifications of the RF Connector Item Specification Nominal...

Страница 57: ...ial cable or a maximum height of 1 4 mm utilizing a 1 13 mm coaxial cable The following figure shows the specifications of mated plugs using 0 81 mm coaxial cables Figure 24 Dimensions of Mated Plugs...

Страница 58: ...re_Design 57 73 The following figure illustrates the connection between the receptacle RF connector on EM160R GL and the mated plug using a 1 13 mm coaxial cable Figure 26 Space Factor of Mated Connec...

Страница 59: ...NSS antenna MIMO1 and MIMO2 antennas Table 35 Antenna Requirements Type Requirements Main Antenna Tx Rx Rx diversity GNSS Antenna MIMO1 Antenna Rx MIMO2 Antenna Rx VSWR 2 Efficiency 30 Max input power...

Страница 60: ...6 Absolute Maximum Ratings 5 2 Power Supply Ratings The typical input voltage of the module is 3 7 V The following table shows the power supply requirements of the module Table 37 Power Supply Require...

Страница 61: ...1V8 VDDIO_1V8 0 3 V VIL Low level input voltage 0 3 0 35 VDDIO_1V8 V VOH High level output voltage VDDIO_1V8 0 45 VDDIO_1V8 V VOL Low level output voltage 0 0 45 V Parameter Description Min Max Unit 3...

Страница 62: ...rements it is necessary to ensure effective thermal dissipation e g by adding passive or active heat sinks heat pipes vapor chambers Within this range the module remains the ability to establish and m...

Страница 63: ...DMA B2 HSDPA CH9800 23 25 dBm 561 06 mA WCDMA B2 HSUPA CH9800 23 29 dBm 588 27 mA WCDMA B3 HSDPA CH1338 23 07 dBm 595 17 mA WCDMA B3 HSUPA CH1338 23 26 dBm 598 19 mA WCDMA B4 HSDPA CH1638 23 43 dBm 64...

Страница 64: ...D B14 CH5330 24 54 dBm 680 13 mA LTE FDD B18 CH5925 24 83 dBm 716 38 mA LTE FDD B19 CH6075 24 99 dBm 662 82 mA LTE FDD B20 CH6300 24 32 dBm 673 72 mA LTE FDD B25 CH8365 24 68 dBm 752 8 mA LTE FDD B26...

Страница 65: ...faces and points in the product design Table 43 Electrostatic Discharge Characteristics Temperature 25 30 C Humidity 40 5 LTE TDD B48 CH55590 21 88 dBm 305 05 mA WCDMA WCDMA B1 CH10700 24 52 dBm 739 1...

Страница 66: ...d power supply Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible Expose the copper in the PCB area where module is mounted Apply a soft thermal pad with appropr...

Страница 67: ...Please follow the principles below in the module application 5 8 1 Coating If a conformal coating is necessary for the module do NOT use any coating material that may chemically react with the PCB or...

Страница 68: ...ical dimensions and packaging specifications of the module All dimensions are measured in millimeter mm and the dimensional tolerances are 0 15 mm unless otherwise specified 6 1 Mechanical Dimensions...

Страница 69: ...are for illustration purpose only and may differ from the actual module For authentic appearance and label please refer to the module received from Quectel 6 3 M 2 Connector EM160R GL adopts a standar...

Страница 70: ...n The module needs to be fixed firmly to avoid poor contact caused by shaking When installing the module it is recommended to be mounted on the socket with a screw as shown below It is recommended to...

Страница 71: ...eters and process of packaging All figures below are for reference only The appearance and structure of the packaging materials are subject to the actual delivery The module adopts blister tray packag...

Страница 72: ...d put 1 empty blister tray on the top Packing 11 blister trays together and then put blister trays into conductive bag seal and pack the conductive bag Put the seal packed blister trays into the mini...

Страница 73: ...te 5 Quectel_LTE_Module_Thermal_Design_Guide Abbreviation Description bps Bits Per Second DC HSPA Dual carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL Downlink DRx Divers...

Страница 74: ...MS Multimedia Messaging Service MO Mobile Originated MT Mobile Terminated NMOS N type Metal Oxide Semiconductor PDU Protocol Data Unit PPP Point to Point Protocol PRx Primary Receive RF Radio Frequenc...

Страница 75: ...are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter s rule s The Grantee will provide guidance to the host manu...

Страница 76: ...be used only when all FCC IC compliance requirements are met...

Страница 77: ...location with another transmitter then the FCC IC authorization is no longer considered valid and the FCC ID IC ID cannot be used on the final product In these circumstances the OEM integrator will b...

Страница 78: ...are not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user manual shall include...

Страница 79: ...ment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one of th...

Страница 80: ...f certification If the grantee markets their product as being Part 15 Subpart B compliant when it also contains unintentional radiator digital circuity then the grantee shall provide a notice stating...

Страница 81: ...na As long as 2 conditions above are met further transmitter test will not be required However the OEM integrator is still responsible for testing their end product for any additional compliance requi...

Страница 82: ...nt Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment This equipment should be installed and operated with minimum distanc...

Страница 83: ...required However the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed...

Страница 84: ...itions cannot be met for example certain laptop configurations or colocation with another transmitter then the Canada authorization is no longer considered valid and the IC ID cannot be used on the fi...

Страница 85: ...a with the following Contains IC 10224A 2020EM160GL Plaque signal tique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l antenne peut tre install e...

Страница 86: ...all required regulatory information warning as show in this manual Manuel d information l utilisateur final L int grateur OEM doit tre conscient de ne pas fournir des informations l utilisateur final...

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