OAI 200 Series, Руководство по эксплуатации

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12
Exposing the Substrate
1. Turn the contact vacuum adjustment valve counter clockwise and turn the Contact
Vac. switch ON. (NOTE: When printing negative resist, contact must be
proceeded by a nitrogen purge. Purging is done by turning the N
2
PURGE ON
prior to contact and allowing the nitrogen to displace the air in the vacuum
chamber. Turn the
N
2
PURGE OFF after the Contact Vac. is turned ON.)
2. Adjust the Contact Vac. Adjust to the desired level.
3. As an alternative for larger substrates, turn the Sub. Vac. switches OFF. This will
usually improve the contact between the mask and substrate.
4. When you are satisfied with the contact, move the alignment optics to the rear and
the alignment module to the "expose" position (far left) under the light source. After
a delay of approximately one second to allow settling any vibrations which may
have been generated by the movement of the alignment module, the shutter timer
will automatically open the light source shutter for the time period set on the timer.
5. When the shutter closes;
A. Move the alignment module to the "Align/Load" position.
B. Insure that the alignment microscope all the way to the rear.
C. Turn the Sub. Vac. back ON if turned OFF.
D. Turn the Contact Vac. OFF.
E. Open the mask frames.
F. Turn the Sub. Vac. OFF and remove the substrate.