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NXP Semiconductors
UM11729
FRDMGD3162HBIEVM half-bridge evaluation board
3.2 Required equipment
To use this kit, you need:
•
Compatible HybridPACK Drive insulated gate bipolar transistor (IGBT) or SiC
metal-oxide-semiconductor field-effect transistor (MOSFET) module
•
DC link capacitor compatible with the HybridPACK Drive module
•
1.27 mm jumpers for configuration (included with kit)
•
30 µH to 50 µH, high current air core inductor for double pulse testing
•
HV power supply with protection shield and hearing protection
•
20 V, 1.0 A DC power supply
•
500 MHz 2.5 GS/s 4-channel oscilloscope
•
Rogowski coil, PEM Model CWT Mini HF60R, or CTW MiniHF30 (smaller diameter)
•
Isolated high-voltage probes
•
Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•
Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3162HBIEVM is a half-bridge evaluation kit populated with two GD3162
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3162 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and GD3162 gate drivers. The evaluation kit can be connected
to a compatible IGBT or SiC module for half-bridge evaluations and applications
development.
4.2 Board features
•
Capability to connect to HybridPACK Drive module for half-bridge evaluations
•
Adjustable negative VEE gate low drive level (0 V to −10 V DC)
•
Adjustable VCC gate high drive level (10 V to 25 V DC)
•
Jumper configurable for disabling dead time fault protection when short-circuit testing
•
Easy access power, ground, and signal test points
•
Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•
DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•
Negative or positive temperature coefficient connection and configurable for monitoring
module temperature
UM11729
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2022. All rights reserved.
User manual
Rev. 1 — 21 February 2022
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