NXP Semiconductors K32W, Справочное руководство

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SECURITY STATUS
NXP Semiconductors
JN-RM-2080
K32W module development reference manual
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in the section 'Legal information'.
© NXP Semiconductors N.V. 2020. All rights reserved.
For more information, please visit: http://www.nxp.com
Date of release: 27 Mar 2020
Document identifier: JN-RM-2080
14. Contents
1. Introduction ......................................................... 3
1.1 Audience ............................................................ 3
1.2 Regulatory approvals ......................................... 3
2. Reference Design ................................................ 4
3. Block diagram ...................................................... 5
4. Design considerations ........................................ 5
4.1 K32W061/041 device footprint ........................... 7
4.2 PCB Stack-Up .................................................... 8
4.3 RF circuit topology and matching ....................... 9
4.4 Transmission lines ........................................... 10
4.5 Components ..................................................... 11
4.6 GND planes...................................................... 12
4.7 Layers interconnections ................................... 13
4.8 DCDC components .......................................... 13
4.9 Reference Oscillator ......................................... 14
4.10 Decoupling ....................................................... 14
4.10.1 General considerations .................................... 14
4.10.2 VDD(RADIO), FB, VDD_PMU, VDDE and VBAT
decoupling ........................................................ 15
4.11 Traces Isolation .............................................. 17
4.12 GPIOs .............................................................. 17
4.13 Screening can .................................................. 17
5. Optimal PCB placement of a module ............... 18
6. Manufacturing considerations ......................... 19
7. Regulations ........................................................ 21
8. Check list schematic ......................................... 22
9. Check list layout ................................................ 25
10. Abbreviations .................................................... 27
11. References ......................................................... 27
12. List of figures ..................................................... 28
13. List of tables ...................................................... 29
14. Contents ............................................................. 30