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NXP Semiconductors
JN-RM-2080
K32W module development reference manual
JN-RM-2080
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© NXP Semiconductors N.V. 2020. All rights reserved.
Reference manual
Rev. 1.0
— 27 Mar 2020
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Fig 19. Solder paste mask for HVQFN40 40-pin QFN
Fig 20. Vias on the paddle of the HVQFN40 40-pin QFN
25 vias are applied to the paddle. These allow excess solder paste and heated air to be
vented away from the device, preventing the device from being lifted during soldering.
In addition, these vias ensure that a low impedance ground is maintained, which is vital
for optimum RF performance.
