Lenovo ThinkAgile CP, Замена аппаратных компонентов и процедуры технического обслуживания

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–
R
= rank(s)
–
xff
= Device organization (data bit width) of SDRAMs used on this assembly
• x4 = x4 organization (4 DQ lines per SDRAM)
• x8 = x8 organization
• x16 = x16 organization
–
wwwww
is the DIMM bandwidth, in MBps: 2133, 2400, 2666, 2933, 3200
–
aa
is the SDRAM speed grade
–
m
is the DIMM type
– E = Unbuffered DIMM (UDIMM), x64 p 8 bit ECC module data bus
– L = Load Reduced DIMM (LRDIMM), x64 p 8 bit ECC module data bus
– R = Registered DIMM (RDIMM), x64 p 8 bit ECC module data bus
– U = Unbuffered DIMM (UDIMM) with no ECC (x64-bit primary data bus)
–
cc
is the reference design file used for this design
–
d
is the revision number of the reference design used
–
bb
is the JEDEC SPD Revision Encoding and Additions level used on this DIMM
The following illustration shows the location of the DIMM connectors on the system board.
Figure 54. Location of the DIMM connectors on the system board
Chapter 5
.
Part replacement and maintenance procedures
113