COMe-bSL6 – User Guide Rev. 1.4
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2.6.2. Humidity .................................................................................................................................................................................................. 36
2.7. Standards and Certifications ............................................................................................................................................................... 37
2.8. MTBF ............................................................................................................................................................................................................ 38
2.9. Mechanical Specification ...................................................................................................................................................................... 39
2.9.1. Dimensions ............................................................................................................................................................................................. 39
2.9.2. Height ....................................................................................................................................................................................................... 39
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Features and Interfaces ................................................................................................................................................................. 40
3.1. LPC ................................................................................................................................................................................................................. 40
3.2.
S
erial Peripheral Interface (SPI) .......................................................................................................................................................... 40
3.2.1. SPI boot .................................................................................................................................................................................................... 40
3.2.2. Using an External SPI Flash ............................................................................................................................................................... 41
3.2.3. External SPI flash on Modules with Intel® ME – in the PRD .................................................................................................. 42
3.3. M.A.R.S. ........................................................................................................................................................................................................ 42
3.4. Fast I2C ....................................................................................................................................................................................................... 42
3.5. UART............................................................................................................................................................................................................. 42
3.6. Triple Staged Watchdog Timer (WTD) ............................................................................................................................................. 43
3.6.1. Basics ........................................................................................................................................................................................................ 43
3.6.2. WDT Signal ............................................................................................................................................................................................. 43
3.7. GPIO .............................................................................................................................................................................................................. 44
3.8. Real Time Clock (RTC) ............................................................................................................................................................................ 44
3.9. Trusted Platform Module (TPM 2.0) ................................................................................................................................................. 44
3.10. Kontron Security Solution ................................................................................................................................................................... 44
3.11. SpeedStep™ Technology ..................................................................................................................................................................... 44
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System Resources ............................................................................................................................................................................ 46
4.1. Interrupt Request (IRQ) Lines .............................................................................................................................................................. 46
4.2. Memory Area ............................................................................................................................................................................................ 46
4.3. I/O Address Map ...................................................................................................................................................................................... 47
4.4. Peripheral Component Interconnect (PCI) Devices ..................................................................................................................... 49
4.5. I2C Bus ......................................................................................................................................................................................................... 49
4.6. System Management (SM) Bus .......................................................................................................................................................... 49
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Interface Connectors X1A and X1B .............................................................................................................................................. 50
5.1. X1A and X1B Signals ................................................................................................................................................................................. 50
5.2. X1A and X1B Pin Assignment ................................................................................................................................................................. 51
5.2.1. Connector X1A Row A ........................................................................................................................................................................... 52
5.2.2. Connector X1A Row B .......................................................................................................................................................................... 55
5.2.3. Connector X1B Row C .......................................................................................................................................................................... 58
5.2.4. Connector X1B Row D .......................................................................................................................................................................... 61
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uEFI BIOS .............................................................................................................................................................................................. 64
6.1. Starting the uEFI BIOS ............................................................................................................................................................................. 64
6.2. Setup Menus ............................................................................................................................................................................................. 65
6.2.1. Main Setup Menu .................................................................................................................................................................................. 66
6.2.2. Advanced Setup Menu ........................................................................................................................................................................ 67
6.2.3. Chipset Setup Menu ............................................................................................................................................................................ 78
6.2.4. Security Setup Menu ........................................................................................................................................................................... 88
6.2.5. Boot Setup Menu .................................................................................................................................................................................. 89
6.2.6. Save and Exit Setup Menu ................................................................................................................................................................. 90
6.3. The uEFI Shell............................................................................................................................................................................................ 92
6.3.1. Basic Operation of the uEFI Shell .................................................................................................................................................... 92
6.4. uEFI Shell Scripting ................................................................................................................................................................................. 93