COMe-bSL6 – User Guide Rev. 1.4
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2.3.3.
Chipset
The COMe-bSL6 is a two-chip solution implementing the Skylake-H CPU and CM236/QM170 Platform Controller Hub.
2.3.3.1.
Platform Controller Hub (PCH)
The following table lists the PCH features.
Rapid Storage
Currently not supported
USB
4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
VT-d
Supported
TXT
Supported
SATA RAID
Supported
2.3.4.
System Memory
The COMe-bSL6 supports a dual DDR4 memory interface with one SO-DIMM socket per channel. The sockets support
the following system memory features.
Socket
2x SO-DIMM DDR4
Memory Type
Channel 1: DDR4-2133 SODIMM up to 16 GB non ECC
Channel 2: DDR4-2133 SODIMM up to 16 GB non ECC
Memory Module Size
4GB, 8 GB and 16 GB
Bandwidth
34.1 Gb/s at 2133 MT/s
2.3.4.1.
Memory Operating Frequencies
The system memory’s frequency is the lowest frequency of all the memory modules placed in the system. Each
memory module’s frequency can be determined through the memory module’s SPD register.
The table below lists the operating memory frequencies based on the combination of DIMMs and processors.
DIMM Type
Module
Name
Memory Data
Transfers
(MT/s)
Processor System
Bus Frequency
(MHz)
Resulting
Memory Clock
Frequency (MHz)
Peak Transfer
Rate (MB/s)
DDR4 2133
PC4-17000
2133.33
2133
266.76
17066.67
For a list of Kontron memory modules, see Table 7: Memory Modules.
In general, memory modules have a much lower longevity than Computer-on-Modules, and therefore the EOL of the
memory modules may occur several times during the lifetime of a Computer-on-Module. Kontron guarantees to
maintain memory modules by replacing EOL memory modules with another similar type of qualified module.
As a minimum, it is recommend to use Kontron memory modules for prototype system(s) in order to prove the
stability of the system and as a reference.
For volume production, you might request to test and qualify other types of RAM. In order to qualify RAM it is
recommend to configure three systems running a RAM Stress Test program in a heat chamber at 60°C, for a minimum
of 24 hours.