Product Description
Dual-Core Intel® Xeon® Processor LV and Intel
®
3100 Chipset
User’s Manual
January 2007
26
Order Number:315879-002
1.8.1.2
Passive Heatsinks
Passive heatsinks (
Figure 14
) require no power and can replace active heatsinks in
appropriate environments. We are only exemplifying a passive Heatsink for the chipset,
as there are multiple passive heatsink designs for the Processor that can be used
(provided appropriate airflow) and are described in the Thermal Design Guide in which
your Intel representative can provide to you.
1.9
Physical and Mechanical Board Specifications
1.9.1
Mounting Holes
The CRB provides non-plated mounting holes with top and bottom ground rings in
locations that correlate with the ATX 2.3 specification. The size of the CRB is
approximately 10.75 inches long by 12 inches wide.
1.10
Debug Ports
The CRB provides an XDP header that can be used to debug the processor and the
Intel
®
3100 Chipset.
1.11
Real Time Clock (RTC), CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real time clock (RTC) and CMOS memory. The
battery has an estimated life of three years when it is not plugged into a wall socket.
When the platform is plugged in, the standby current from the power supply extends
the life of the battery. The clock is accurate to ± 13 minutes/year at 25º C with 3.3 VSB
applied.
Note:
If the battery and AC power fail, at boot-up the system will prompt you to either load
optimized defaults or enter BIOS and manually adjust your BIOS settings.
Figure 14.
Intel
®
3100 Chipset Passive Heatsink Design
