Data Sheet
172
Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
17.3
Thermal Behavior of Package
Below figure shows the thermal resistance (
R
th_JA
) of the device vs. the cooling area on the bottom of the PCB
for Ta = 85°C. Every line reflects a different PCB and thermal via design.
Figure 62 Thermal Resistance (
R
th_JA
) vs. Cooling Area
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