TLE9263BQXV33
General Product Characteristics
Data Sheet
14
Rev. 1.00, 2017-07-31
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Temperatures
Junction Temperature
T
j
-40
–
150
°C
–
P_4.1.15
Storage Temperature
T
stg
-55
–
150
°C
–
P_4.1.16
ESD Susceptibility
ESD Resistivity
V
ESD,11
-2
–
2
kV
HBM
3)
P_4.1.17
ESD Resistivity to GND, HSx
V
ESD,12
-2
–
2
kV
HBM
3)
P_4.1.18
ESD Resistivity to GND,
CANH, CANL, LINx
V
ESD,13
-8
–
8
kV
HBM
4)3)
P_4.1.19
ESD Resistivity to GND
V
ESD,21
-500
–
500
V
CDM
5)
P_4.1.20
ESD Resistivity Pin 1,
12,13,24,25,36,37,48 (corner
pins) to GND
V
ESD,22
-750
–
750
V
CDM
5)
P_4.1.21
1) Not subject to production test, specified by design.
2) Applies only if WK1 and WK2 are configured as alternative HV-measurement function
3) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 k
Ω
, 100 pF)
4) For ESD “GUN” Resistivity 6KV (according to IEC61000-4-2 “gun test” (150pF, 330
Ω
)), will be shown in Application
Information and test report will be provided from IBEE
5) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1
Table 1
Absolute Maximum Ratings
1)
(cont’d)
T
j
= -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Number
Min.
Typ.
Max.
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