IBM TotalStorage EXP100, Инструкция по установке, использованию и обслуживанию

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4. Substantial deviations from the suggested operating range, in either direction, if
sustained for extended periods of time, will expose the unit to greater risk of
failure from external causes.
Heat output, airflow, and cooling
The maximum heat output of the EXP100 is 390 watts (1088 BTU/hr). Each
EXP100 rack-mounted unit requires an airflow of 2.5 m
3
(87 ft
3
) per minute. The
input air temperature to all racks should be in the range 10° C - 35° C (50° F - 95°
F).
Note: In general, disk subsystem reliability tends to decrease as the ambient
temperature of the environment in which it is being used increases. The
ambient temperature in the immediate area of the storage expansion
enclosure should be kept near 22 degrees C (72 degrees F), or lower, to
provide better reliability.
When racks that contain many EXP100s are to be installed together, the following
requirements must be met to ensure that the EXP100s are adequately cooled:
v Air enters at the front of the rack and leaves at the back. To prevent the air that
is leaving the rack from entering the intake of another piece of equipment, you
must position the racks in alternate rows, back-to-back and front-to-front. This
arrangement is known as “cold aisle/hot aisle” and is shown in Figure 8 on page
24.
v Where racks are in rows, each rack must touch the rack that is next to it to
reduce the amount of hot air that can flow around from the back of the rack into
the intakes of the expansion enclosures that are in that rack. You should use
Suite Attach Kits to completely seal any gaps that remain between the racks. For
details about Suite Attach Kits, contact your marketing representative.
v
Where racks are in rows front-to-front or back-to-back, a gap of at least 1220 mm
(48 in.) must separate the rows across the cold aisle.
v To ensure correct airflow in each rack, the rack filler plates must be installed in
unused positions. Also, all the gaps in the front of the racks must be sealed,
including the gaps between the expansion enclosures.
Chapter 1. Introduction
23