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µPG 501
16
User Guide
Check the design parameters listed in the window to make sure the design was
converted with the correct parameters.
B Substrate Loading
1. Make sure the cover lid (1) is closed (interlock lamp (10) off) and the
compressed air is present.
2. Click on the button
Load Substrate
. A message box opens that guides through
the loading process. Click
OK
. The write head is raised and the stage moves to
the loading position at the front of the machine.
3. Wait until all movement has finished. Open the cover lid. On the chuck, mount
the alignment pins (masks: three, wafers: two) in the appropriate positions for the
plate size to be used (see left part of Figure 5).
4. Switch off all light except safe light. Take a substrate out of its storage container.
Check substrate quality.
•
Make sure the substrates comply with the specifications of the µPG 501
(Size between 2” and 5”, max. thickness 6mm, flatness tolerance < ± 20µm)
•
Never use out-of-date substrates.
•
Do not use substrates with scratches on top or bottom, visible
contaminations in the resist, or non-uniform resist distribution in the area to
be exposed.
5. Make sure the resist coated side of the substrate is turned up, and position it
against the alignment pins. If the substrate bears alignment marks that should be
used for exposure,
note that the coordinate system of the stage is oriented
such that the x axis corresponds to a backward-forward movement, while
the y-axis corresponds to a left-right movement when standing in front of
the machine
(see Figure 6).
The four center vacuum suction holes are always active when the vacuum is
switched on, holding down small substrates. For substrate sizes of 2" or larger,
additional vacuum region extensions can be added using the vacuum field
selection screws (4) (see right part of Figure 5, and Figure 7). Switch on the
vacuum with the vacuum switch (5). Check whether the plate is really held tight
by trying to move it slightly sideways. If plate is not held, switch off the vacuum
and clean plate backside and chuck before trying again. If problems persist, use
a different substrate.
6. Remove all alignment pins. Close the cover lid (1) and make sure the interlock
lamp (10) is off.
NOTICE:
If the alignment pins are left on the stage during exposure of a thin
substrate, the system can take
serious damage
!
7. Click
OK
in the message box. The stage moves to the center position, and the
write head moves down until the focal point is on the substrate surface.
8. A message box opens, offering to start the Find Plate Center procedure. Click
OK
if the origin should be set in the center of the plate, or if it is for other reasons
of interest to have the write head exactly above the substrate center (e.g.,
because it is a good starting point to find alignment sites).
Содержание mPG 501
Страница 1: ...User Guide PG 501...
Страница 2: ...PG 501 ii User Guide Doc No DWL HI 049 Revision 5 Feb 2014 Copyright 2014 by Heidelberg Instruments...
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Страница 40: ...PG 501 36 User Guide Notes...
Страница 41: ...PG 501 User Guide 37 Notes...
Страница 42: ...PG 501 38 User Guide Notes...