LSA-10A-30-D-130 Technical Document
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4-11 Caution Regarding Driver Installation
The driver needs to release heat in response to operating conditions.
Please secure the heat sink attachment of the radiator plate to one of the two surfaces in the diagram
below.
Furthermore, it is recommended that silicon grease is applied to the attachment surface when securing.
In addition, the heat sink and board circuit are connected through
the condenser (0.1 μF).
•
The temperature of the driver’s Power IC rises according to the operating conditions (when large
currents flow continuously, etc.) and the device may shut down due to Power IC Overheating
Protection (4-2).
Intermittent instability may occur during beginning of shutdown and auto return. Before the
operation of the Power IC Overheating Protection in this case, refer to Overheat Alarm Output
(4-6-6) to have the sequence configuration to be Enable OFF.
Please conduct commands input and heat release process of the driver to ensure that the
detector’s temperature of the overheat alarm does not exceed the allowed value.
•
The consumption current of the scanner is the smallest at the scanner’s origin and increases with
distance away from the scanner’s origin, when suspending positioning. The temperature of the
driver’s Power IC increases according to the status of head release and the Power IC Overheating
Protection may shutdown the device. When suspending the positioning at a specified position for a
long time with the shutter etc, please try to suspend in the vicinity of the scanner origin.
•
We will submit the heat release conditions that meet the customer’s driving conditions during the
advanced testing stage. In addition, the warm-up time is approximately 5 [min].
Attachment Face
Temperature Sensor
Heat Release Fin (2 Units)
Power IC (2 Units)
Heat Sink
Radiator Plate
