ADT7476
Rev. B | Page 9 of 72
TYPICAL PERFORMANCE CHARACTERISTICS
0
–10
–20
–30
–40
–50
–60
0
2
4
6
8
10
12
CAPACITANCE (nF)
T
E
M
PER
A
T
U
R
E ER
R
O
R
(
°C
)
14
16
18
20
22
05
382
-00
4
Figure 4. Temperature Error vs. Capacitance Between D+ and D−
30
20
10
0
–10
–20
–30
0
20
40
60
LEAKAGE RESISTANCE (M
Ω
)
T
E
M
P
E
RAT
URE
E
RRO
R (
°C)
80
100
–40
05
38
2-
0
06
D+ TO V
CC
D+ TO GND
Figure 5. Remote Temperature Error vs. PCB Resistance
30
25
20
15
10
5
0
–5
0
100M
200M
300M
400M
500M
600M
NOISE FREQUENCY (Hz)
T
E
M
P
E
RAT
URE
E
RRO
R (
°C)
100mV
60mV
40mV
05
38
2-
0
07
Figure 6. Remote Temperature Error vs. Common-Mode Noise Frequency
70
60
50
40
30
20
0
10
0
100M
200M
300M
400M
500M
600M
NOISE FREQUENCY (Hz)
T
E
M
P
E
RAT
URE
E
RRO
R (
°C)
40mV
05
38
2-
00
8
–10
60mV
100mV
Figure 7. Remote Temperature Error vs. Differential Mode Noise Frequency
1.20
1.18
1.16
1.14
1.12
1.10
1.08
1.06
3.0
3.1
3.2
3.3
3.4
V
DD
(V)
I
DD
(mA)
1.04
1.02
3.5
3.6
1.00
0.98
05382-009
Figure 8. Normal I
DD
vs. Power Supply
100mV
250mV
15
10
5
0
–5
–10
–15
0
100M
200M
300M
400M
500M
600M
FREQUENCY (Hz)
T
E
M
P
E
RAT
URE
E
RRO
R (
°C)
05
38
2-
0
10
Figure 9. Internal Temperature Error vs. Power Supply
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