Amada UNIFLOW 4 REMOTE, Руководство по эксплуатации, Страница: 54 / 176

CHAPTER 3: USING PROGRAMMING FUNCTIONS
UNIFLOW
®
4 PULSED HEAT CONTROL
3-4 990-908
You can include a process cycle in a
Profile by assigning the desired process
cycle a time of greater than 0 seconds.
The Control requires that every Profile
has at least one process cycle,
Reflow ,
with a time of at least 0.1 seconds.
Base
You can use
Baseheat
to provide a consistent temperature starting point for the process. The
temperature for this state is displayed as 60

C (note the Celsius units at the right hand side of the screen)
and time as 01.0 seconds (note the seconds units at the right hand side of the screen.
Baseheat
can be
set from 25° to 300°C and 0 to 99.9 seconds. When it is set to 00.0 seconds, the
Baseheat
state is
omitted.
Rise1
You can use
Rise1
to reduce the temperature overshoot at the beginning of
Preheat
.
Rise1
is shown as
being set for 1.0 seconds. It can be set from 0 to 9.9 seconds. When it is set to 0.0 seconds, the
Rise1
state is omitted.
Preheat
You can use
Preheat
to activate flux for removing solder oxides between solder plated parts. You can
also use
Preheat
to reduce warping on large thermodes by decreasing the temperature difference
between
Preheat
and
Reflow
periods.
The temperature for this state is displayed as 150

C and the time is 01.0 seconds.
Preheat
can be set
from 60° to 500°C and from 0 to 99.9 seconds. When it is set to 00.0 seconds, the
Preheat
state is
omitted from the heat profile.
Rise2
You use
Rise2
to reduce the thermode warping caused by rapidly heating from the
Preheat
setting to the
Reflow
setting.
Rise2
is shown as being set for 2.0 seconds. It can be set from 0 to 9.9 seconds. When it
is set to 0.0 seconds, the
Rise2
state is omitted.
Reflow
You use the
Reflow
period to actually melt the solder for a reflow solder joint, or set thermoplastic or
thermoset conductive adhesives for a heat-seal joint.