Air-Vac PCBRM100, Руководство пользователя

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PCBRM100 User’s Guide Chapter 5: Process Development
4101.00.902 5-5
13) Never touch a nozzle with your hand. Always use the nozzle handling tool to install and re-
move nozzles.
14) A “trick” to square the flow well during installation is to use the right edge of the carrier as
reference.
15) A solder pot heater setting of 285°C yields 260°C solder temperature at the top of the flow
well.
16) It is important to check the vacuum in the barrel cleaning nozzle before running the barrel
cleaning process. The open setting should be approximately 10Hg while the closed value
should be 17-20 Hg.
17) A barrel cleaning process where the vacuum tip initially touches an open barrel will fail. A
vacuum sensor in the head takes a reading before touching (open) and after touching
(closed). Touching down on an open barrel will have an open signal.
18) A barrel cleaning restart function is part of every removal and barrel cleaning process. You
will need the restart function if an error message occurs for any reason during barrel clean-
ing. You will be instructed how to use the restart function during the process development
and training session.
19) When installing a nozzle match the nozzle indent to the front nozzle holding finger. Look at
the squareness of the nozzle and turn it slightly if needed. This will help prevent nozzle
alignment failure.
20) Component x/y/z dimensions in the board image take precedence over component x/y/z di-
mensions in a profile (notes page).
21) Use care when taping the adjacent close to the 5 pin switch. If the tape interferes with the
small vacuum tip it may cause failure.
22) Do not try to “trick” the machine in regard to the nozzle. For example, if you want to test just
the barrel cleaning process in a removal and barrel profile and you leave the BC nozzle in for
the entire process, the BC nozzle will contact the board during the removal event.