Advantech SOM-ETX Design Guide
4.1.2 Six layer board stack-up
Figure 4.2 illustrates an example of a six-layer stack-up with 4 signal layers and 2
power planes. The two power planes are the power layer and the ground layer. The
layer sequence of component-ground-IN1-IN2-power-solder is the most common
stack-up arrangement from top to bottom.
Figure 4-2
L6 Signal Layer
Prepreg
L1 Signal Layer
Prepreg
L2 Ground Layer
Total
Thickness
62 mils
62 m
ils
Core
L3 IN1
Prepreg
L4 IN2
L5 Power Layer
Core
Table 4.2 Recommended Board Stack-Up Dimensions
Layer Layer
Single-End Signals
Differential Signals
USB differential Signals
Dielectric
Thickness
(mil)
No Type
Width
(mil)
Impedance
(ohm)
Width
(mil)
Width
Impedance
(ohm)
(mil)
Impedance(ohm)
1.7 L1
Signals
5/5
55+/-10%
5/6/5
100+/-10%
5/4/5
90+/-10%
4
Prepreg
1.4 L2
Ground
5
Core
1.4 L3
55+/-10%
IN1
5/5
4/8/4
100+/-10%
4/5/4
90+/-10%
35
Prepreg
1.4 L4
IN2
5
Core 5/5
55+/-10%
4/8/4
100+/-10%
4/5/4
90+/-10%
1.4 L5
Power
4
Prepreg
1.7 L6
Signals
5/5
55+/-10%
5/6/5
100+/-10%
5/4/5
90+/-10%
Notes :
Target PCB Thickness totals 62mil+/-10%
Chapter 4 General Design Recommendations
59
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